PEF 2466 H V2.2

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Mfr.Part #
PEF 2466 H V2.2
Manufacturer
Infineon Technologies
Package / Case
64-QFP
Datasheet
Download
Description
IC TELECOM INTERFACE MQFP-64
Stock
13,610
In Stock :
13,610

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Interface :
PCM, SPI
Power (Watts) :
130mW
Base Part Number :
PEF2466
Number of Circuits :
4
Supplier Device Package :
P-MQFP-64-1
Operating Temperature :
-40°C~85°C
Package / Case :
64-QFP
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
5V
Function :
CODEC Filter
Series :
SICOFI®
Packaging :
Tape and Reel (TR)
Current - Supply :
26mA
Mounting Type :
Surface Mount
Datasheets
PEF 2466 H V2.2
Introducing Telecom Infineon Technologies PEF 2466 H V2.2 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PEF2466, Operating Temperature:-40°C~85°C, Package / Case:64-QFP, Mounting Type:Surface Mount, PEF 2466 H V2.2 pinout, PEF 2466 H V2.2 datasheet PDF, PEF 2466 H V2.2 amp .Beyond Telecom Infineon Technologies PEF 2466 H V2.2 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies PEF 2466 H V2.2


Telecom Infineon Technologies PEF 2466 H V2.2 Overview

The Infineon Technologies PEF 2466 H V2.2 is a cutting-edge IC telecom interface designed to meet the rigorous demands of modern telecommunications infrastructure. As a critical component in the development of telecommunication systems, this interface chip is engineered for high performance and reliability, providing robust solutions for network operators and telecom equipment manufacturers. The PEF 2466 H V2.2 enhances system capabilities with its advanced features, making it an ideal choice for applications requiring efficient and stable communication protocols. This product embodies the innovative spirit of Infineon Technologies, ensuring that systems not only meet current telecom standards but are also future-ready.

PEF 2466 H V2.2 Features

This interface IC is packed with features designed for superior telecom performance. Key features include a Multi-Quantum Flat Pack 64 (MQFP64) package, providing a compact yet powerful solution for dense circuit designs. It supports various communication protocols, enhancing device interoperability and connectivity. Furthermore, the PEF 2466 H V2.2 boasts low power consumption and high durability, which are essential for prolonged operational life in harsh telecom environments.

PEF 2466 H V2.2 Applications

  • Telecommunication Switching Systems: Utilized in the core of switching systems to manage and route voice and data traffic efficiently across networks.
  • High-Speed Modems: Critical in enabling high-speed data transmission rates for broadband services, enhancing the user's internet experience.
  • Integrated Access Devices (IAD): Offers a seamless integration in devices that converge voice and data services, typically used in residential and small business environments.
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