PEF 22554 E V2.1-G
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- Mfr.Part #
- PEF 22554 E V2.1-G
- Manufacturer
- Infineon Technologies
- Package / Case
- 160-LBGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 160LBGA
- Stock
- 30,324
- In Stock ：
- 30,324
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Moisture Sensitivity Level (MSL) :
- 2A (4 Weeks)
- Operating Temperature :
- -40°C~85°C
- Mounting Type :
- Surface Mount
- Supplier Device Package :
- P/PG-LBGA-160-1
- Number of Circuits :
- 4
- Function :
- Framer, Line Interface Unit (LIU)
- Package / Case :
- 160-LBGA
- Voltage - Supply :
- 1.8V 3.3V
- Series :
- QuadFALC™
- Base Part Number :
- PEF22554
- Interface :
- E1, HDLC, J1, T1
- Packaging :
- Tray
- Datasheets
- PEF 22554 E V2.1-G
PEF22554 Telecom device 4 Circuits
PEF 22554 E V2.1-G Overview
A 160-LBGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 4 circuits.Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The PEF22554 base part number can be used to find more related parts.With the QuadFALC™ series electronic parts, it can perform similar functions of the telecommunication product .
PEF 22554 E V2.1-G Features
Available in the 160-LBGA package
PEF 22554 E V2.1-G Applications
There are a lot of Infineon Technologies
PEF 22554 E V2.1-G Telecom applications.
- Fractional T1/E1/J1
- BITS Timing
- Digital Access Cross-connect System (DACs)
- Digital Cross-connect Systems (DCS)
- Frame Relay Switches and Access Devices (FRADS)
- ISDN Primary Rate Interfaces (PRA)
- PBXs channel bank
- PCM channel bank
- T3 channelized access concentrators
- M13 MUX
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