PEB 3264 H V1.4

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Mfr.Part #
PEB 3264 H V1.4
Manufacturer
Infineon Technologies
Package / Case
64-QFP
Datasheet
Download
Description
IC TELECOM INTERFACE MQFP-64
Stock
3,024
In Stock :
3,024

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Current - Supply :
105mA
Operating Temperature :
0°C~70°C
Number of Circuits :
2
Packaging :
Tray
Supplier Device Package :
P-MQFP-64-1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Function :
Dual Channel Subscriber Line Interface Circuit (DuSLIC)
Voltage - Supply :
3.3V
Base Part Number :
PEB3264
Mounting Type :
Surface Mount
Package / Case :
64-QFP
Interface :
IOM-2, PCM
Series :
DuSLIC
Datasheets
PEB 3264 H V1.4
Introducing Telecom Infineon Technologies PEB 3264 H V1.4 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C, Base Part Number:PEB3264, Mounting Type:Surface Mount, Package / Case:64-QFP, PEB 3264 H V1.4 pinout, PEB 3264 H V1.4 datasheet PDF, PEB 3264 H V1.4 amp .Beyond Telecom Infineon Technologies PEB 3264 H V1.4 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies PEB 3264 H V1.4


Telecom+Infineon Technologies+PEB 3264 H V1.4 Overview

Infineon Technologies的PEB 3264 H V1.4是一款高性能的电信接口集成电路(IC),设计用于多种电信应用。它采用了MQFP64封装,为开发者提供了灵活的集成方式,并且能够在复杂的通信系统中稳定运行。该器件的高可靠性和卓越性能使其成为电信系统设计的理想选择。通过使用Telecom+Infineon Technologies+PEB 3264 H V1.4,客户可以确保他们的电信设备在苛刻的环境下保持高效运作。它的多功能性和兼容性进一步增强了其在行业中的应用范围。该IC在提高数据传输速度、优化信号处理和支持多种通信协议方面具有显著优势。

PEB 3264 H V1.4 Features

- MQFP64封装:该封装形式提供了灵活性和良好的散热性能,适用于紧凑设计。 - 多协议支持:PEB 3264 H V1.4支持多种电信协议,使其适应不同的应用需求。 - 高可靠性:该IC具有卓越的耐久性,确保在长期使用中保持稳定。 - 高性能:提供快速的数据处理和高效的信号传输,适合高负载应用。

PEB 3264 H V1.4 Applications

- **电话交换机**:该IC用于电话交换机系统中,以实现高效的呼叫处理和信号路由。 - **通信网络**:PEB 3264 H V1.4可以集成到通信网络设备中,提高数据传输速率和稳定性。 - **远程通信**:适用于远程通信系统,提供可靠的信号传输和处理能力。 - **数据通信**:在数据通信设备中,该IC可以优化数据处理,确保稳定的通信链接。
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