PEB 3264 F V1.4

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Mfr.Part #
PEB 3264 F V1.4
Manufacturer
Infineon Technologies
Package / Case
64-LQFP
Datasheet
Download
Description
IC TELECOM INTERFACE TQFP-64
Stock
43,160
In Stock :
43,160

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Number of Circuits :
2
Package / Case :
64-LQFP
Supplier Device Package :
P-TQFP-64
Operating Temperature :
0°C~70°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
3.3V
Function :
Dual Channel Subscriber Line Interface Circuit (DuSLIC)
Current - Supply :
105mA
Series :
DuSLIC
Base Part Number :
PEB3264
Packaging :
Tape and Reel (TR)
Interface :
IOM-2, PCM
Mounting Type :
Surface Mount
Datasheets
PEB 3264 F V1.4
Introducing Telecom Infineon Technologies PEB 3264 F V1.4 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:64-LQFP, Operating Temperature:0°C~70°C, Base Part Number:PEB3264, Mounting Type:Surface Mount, PEB 3264 F V1.4 pinout, PEB 3264 F V1.4 datasheet PDF, PEB 3264 F V1.4 amp .Beyond Telecom Infineon Technologies PEB 3264 F V1.4 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies PEB 3264 F V1.4


Telecom Infineon Technologies PEB 3264 F V1.4 Overview

The Telecom Infineon Technologies PEB 3264 F V1.4 is a cutting-edge Integrated Circuit (IC) designed for sophisticated telecommunications interfaces. This product, housed in a TQFP64 package, is engineered by Infineon Technologies, one of the leaders in semiconductor innovation. The IC is tailored to enhance the performance and reliability of telecom systems, offering advanced interface solutions that cater to the demanding needs of modern telecommunications infrastructure. The IC ensures high-speed data transmission and optimized functionality, making it an ideal choice for developers looking to boost system performance and efficiency.

PEB 3264 F V1.4 Features

The PEB 3264 F V1.4 IC incorporates multiple features that make it a robust option for telecommunications applications. Its compact TQFP64 package allows for efficient use of PCB space, while its design ensures low power consumption and high signal integrity. Additionally, the chip supports multiple communication protocols, enhancing its versatility and making it suitable for a wide range of telecommunication applications.

PEB 3264 F V1.4 Applications

  • VoIP Systems: Employs advanced signal processing capabilities to facilitate clear and reliable voice over IP communications.
  • Wireless Base Stations: Integral in managing data flow and signal integrity in high-demand wireless telecommunications infrastructure.
  • Fiber Optic Networks: Enhances signal processing functions crucial for the high-speed data transmission requirements of modern fiber optic networks.
  • Broadband Access Equipment: Utilized to ensure efficient and stable broadband connectivity, supporting both residential and commercial environments.
  • Network Interface Cards: Provides the necessary interface functionalities that allow for seamless integration with existing network infrastructures.
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