PC28F00AP33EFA

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Mfr.Part #
PC28F00AP33EFA
Manufacturer
Micron Technology
Package / Case
64-TBGA
Datasheet
Download
Description
IC FLASH 1GBIT PAR 64EASYBGA
Stock
806
In Stock :
806

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Manufacturer :
Micron Technology
Product Category :
Memory
Address Bus Width :
26b
Voltage :
2.3V
Number of Pins :
64
Radiation Hardening :
No
Memory Size :
1Gb 64M x 16
Access Time (Max) :
95 ns
Packaging :
Tray
REACH SVHC :
No SVHC
Density :
1 Gb
Write Cycle Time - Word, Page :
95ns
Word Size :
16b
Mounting Type :
Surface Mount
Memory Format :
Flash
Series :
Axcell™
Package / Case :
64-TBGA
Base Part Number :
28F00AP33
Time@Peak Reflow Temperature-Max (s) :
30
Height :
1.2mm
Supply Voltage :
3V
JESD-609 Code :
e1
Pin Count :
64
Width :
8.1mm
Nominal Supply Current :
31mA
RoHS Status :
ROHS3 Compliant
Clock Frequency :
52MHz
Interface :
Parallel, Serial
Voltage - Supply :
2.3V~3.6V
Length :
10.1mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Contact Plating :
Copper, Silver, Tin
Memory Interface :
Parallel
Surface Mount :
yes
Memory Type :
Non-Volatile
Published :
2010
Sync/Async :
ASYNCHRONOUS
Terminal Position :
BOTTOM
Number of Terminations :
64
Number of Functions :
1
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
yes
Peak Reflow Temperature (Cel) :
260
Datasheets
PC28F00AP33EFA
Introducing Memory Micron Technology PC28F00AP33EFA from Chip IC,where excellence meets affordability. This product stands out with its Voltage:2.3V, Number of Pins:64, Mounting Type:Surface Mount, Package / Case:64-TBGA, Base Part Number:28F00AP33, Number of Terminations:64, Operating Temperature:-40°C~85°C TA, PC28F00AP33EFA pinout, PC28F00AP33EFA datasheet PDF, PC28F00AP33EFA amp .Beyond Memory Micron Technology PC28F00AP33EFA ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology PC28F00AP33EFA


Memory Micron Technology PC28F00AP33EFA Overview

Introducing the PC28F00AP33EFA from Micron Technology, a cutting-edge Memory component that seamlessly integrates into your advanced electronic systems. This high-performance IC FLASH boasts a significant 1Gbit storage capacity in a compact 64EasyBGA package, designed for applications demanding high-speed and reliable data storage. The robust design and enhanced durability of the PC28F00AP33EFA make it an ideal choice for manufacturers looking to innovate and enhance their product offerings. With its advanced technology and Micron's reputable engineering, this memory module facilitates efficient handling and storage of substantial data volumes, ensuring operational excellence in complex environments.

PC28F00AP33EFA Features

The PC28F00AP33EFA FLASH memory chip includes several features that make it stand out in the industry. It operates with parallel interface technology, allowing for quicker data access and processing compared to serial flash technologies. The 64EasyBGA package is optimized for space-saving on PCBs, making it ideal for devices where space is at a premium. Additionally, its 1Gbit capacity enables substantial data storage, which is essential for data-intensive applications.

PC28F00AP33EFA Applications

  • Mobile Devices: Utilized in smartphones and tablets to enhance the storage capacity, allowing for richer user experiences with more apps and multimedia content stored on the device.
  • Automotive Systems: Applied in automotive infotainment systems, the PC28F00AP33EFA helps in managing large volumes of data required for navigation, media playback, and system updates.
  • Internet of Things (IoT): Essential for IoT devices, which require robust and reliable data storage for logging extensive amounts of data collected from sensors and other devices in smart homes and industrial automation.
  • Consumer Electronics: Used in gaming consoles and digital cameras, where high storage capacity is crucial for saving large game files and high-resolution images and videos.
  • Networking: Helps in networking hardware like routers and switches, storing firmware and configurations necessary for device operations and connectivity.
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