NZX3V9B,133

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Case Connection :

Isolated

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mounting Type :

Through Hole

ECCN Code :

EAR99

Radiation Hardening :

No

Power Dissipation :

500mW

Polarity :

Unidirectional

Factory Lead Time :

6 Weeks

Diode Element Material :

SILICON

Terminal Finish :

Tin (Sn)

Diode Type :

ZENER DIODE

Lead Free :

Lead Free

Working Voltage :

3.9V

Current - Reverse Leakage @ Vr :

3μA @ 1V

Reference Standard :

IEC-60134

Element Configuration :

Single

Max Reverse Leakage Current :

3μA

Max Power Dissipation :

500mW

Working Test Current :

5mA

JESD-609 Code :

e3

Zener Voltage :

3.9V

Voltage Tolerance :

3%

Package / Case :

DO-204AH, DO-35, Axial

Tolerance :

±3%

Peak Reverse Current :

3μA

Mount :

Through Hole

Voltage - Forward (Vf) (Max) @ If :

1.5V @ 200mA

Base Part Number :

NZX3V9

Impedance :

100Ohm

Reference Voltage :

3.9V

Operating Temperature :

-55°C~175°C

Terminal Form :

Wire

Number of Terminations :

2

Time@Peak Reflow Temperature-Max (s) :

30

Impedance-Max :

100Ohm

Packaging :

Tape and Box (TB)

Peak Reflow Temperature (Cel) :

260

Published :

2011

Number of Elements :

1

Forward Voltage :

1.5V

RoHS Status :

Non-RoHS Compliant

HTS Code :

8541.10.00.80

Number of Pins :

2

Pin Count :

2