NZX3V9B,133

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Max Reverse Leakage Current :

3μA

Packaging :

Tape and Box (TB)

Number of Pins :

2

Working Test Current :

5mA

Peak Reflow Temperature (Cel) :

260

Impedance :

100Ohm

Radiation Hardening :

No

Reference Standard :

IEC-60134

Impedance-Max :

100Ohm

Package / Case :

DO-204AH, DO-35, Axial

RoHS Status :

Non-RoHS Compliant

Reference Voltage :

3.9V

JESD-609 Code :

e3

Diode Type :

ZENER DIODE

Number of Terminations :

2

Forward Voltage :

1.5V

Power Dissipation :

500mW

Time@Peak Reflow Temperature-Max (s) :

30

Published :

2011

Lead Free :

Lead Free

Current - Reverse Leakage @ Vr :

3μA @ 1V

Base Part Number :

NZX3V9

Max Power Dissipation :

500mW

HTS Code :

8541.10.00.80

Pin Count :

2

Polarity :

Unidirectional

Mount :

Through Hole

Operating Temperature :

-55°C~175°C

Voltage - Forward (Vf) (Max) @ If :

1.5V @ 200mA

Terminal Finish :

Tin (Sn)

Working Voltage :

3.9V

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Peak Reverse Current :

3μA

ECCN Code :

EAR99

Zener Voltage :

3.9V

Element Configuration :

Single

Voltage Tolerance :

3%

Terminal Form :

Wire

Diode Element Material :

SILICON

Factory Lead Time :

6 Weeks

Tolerance :

±3%

Case Connection :

Isolated

Mounting Type :

Through Hole

Number of Elements :

1