NZX3V9A,133

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Working Test Current :

5mA

Mount :

Through Hole

Case Connection :

Isolated

Terminal Form :

Wire

Radiation Hardening :

No

Zener Voltage :

3.8V

RoHS Status :

Non-RoHS Compliant

Power Dissipation :

500mW

Element Configuration :

Single

Tolerance :

±3%

Reference Standard :

IEC-60134

Max Power Dissipation :

500mW

HTS Code :

8541.10.00.80

Polarity :

Unidirectional

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Diode Element Material :

SILICON

Working Voltage :

3.9V

Diode Type :

ZENER DIODE

Lead Free :

Lead Free

Max Reverse Leakage Current :

3μA

Forward Voltage :

1.5V

Pin Count :

2

Voltage - Forward (Vf) (Max) @ If :

1.5V @ 200mA

Published :

2011

Number of Elements :

1

Number of Pins :

2

ECCN Code :

EAR99

Impedance-Max :

100Ohm

Operating Temperature :

-55°C~175°C

Time@Peak Reflow Temperature-Max (s) :

30

Mounting Type :

Through Hole

Impedance :

100Ohm

JESD-609 Code :

e3

Reference Voltage :

3.8V

Package / Case :

DO-204AH, DO-35, Axial

Voltage Tolerance :

3%

Terminal Finish :

Tin (Sn)

Factory Lead Time :

6 Weeks

Current - Reverse Leakage @ Vr :

3μA @ 1V

Packaging :

Tape and Box (TB)

Number of Terminations :

2

Peak Reverse Current :

3μA

Base Part Number :

NZX3V9

Peak Reflow Temperature (Cel) :

260