MXSMBJ170CA

Manufacturer :

Microchip Technology

Product Category :

Terminal Form :

J BEND

Number of Terminations :

2

Voltage - Breakdown (Min) :

189V

Max Reverse Leakage Current :

1μA

Mounting Type :

Surface Mount

Number of Pins :

2

Peak Pulse Power :

600W

Mount :

Surface Mount

Package / Case :

DO-214AA, SMB

Published :

1997

Pin Count :

2

Direction :

Bidirectional

Packaging :

Bulk

Power Line Protection :

No

Power - Peak Pulse :

600W

Diode Element Material :

SILICON

Peak Reflow Temperature (Cel) :

260

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Series :

Military, MIL-PRF-19500

RoHS Status :

Non-RoHS Compliant

Type :

Zener

Bidirectional Channels :

1

Pbfree Code :

yes

Terminal Position :

Dual

Element Configuration :

Single

Applications :

GENERAL PURPOSE

Peak Pulse Current :

2.2A

Reverse Standoff Voltage :

170V

Terminal Finish :

MATTE TIN

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Operating Temperature :

-65°C~150°C TJ

Time@Peak Reflow Temperature-Max (s) :

40

Test Current :

1mA

ECCN Code :

EAR99

Number of Elements :

1

Clamping Voltage :

275V