MXSMBJ11CA

Manufacturer :

Microchip Technology

Product Category :

Mount :

Surface Mount

Mounting Type :

Surface Mount

Number of Terminations :

2

JESD-609 Code :

e0

Bidirectional Channels :

1

Operating Temperature :

-65°C~150°C TJ

Diode Element Material :

SILICON

Peak Pulse Power :

600W

Max Reverse Leakage Current :

5μA

Peak Pulse Current :

33A

Package / Case :

DO-214AA, SMB

Terminal Finish :

Tin/Lead (Sn/Pb)

RoHS Status :

Non-RoHS Compliant

Test Current :

1mA

Terminal Form :

C BEND

Additional Feature :

High Reliability

Series :

Military, MIL-PRF-19500

ECCN Code :

EAR99

Number of Elements :

1

Breakdown Voltage :

12.85V

Element Configuration :

Single

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Packaging :

Bulk

Clamping Voltage :

18.2V

Published :

1997

Applications :

GENERAL PURPOSE

Power - Peak Pulse :

600W

Voltage - Breakdown (Min) :

12.2V

Direction :

Bidirectional

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Number of Pins :

2

Power Line Protection :

No

Pin Count :

2

Reverse Standoff Voltage :

11V

Pbfree Code :

No

Type :

Zener

Terminal Position :

Dual