MXLSMCJ30AE3

Manufacturer :

Microchip Technology

Product Category :

Mount :

Surface Mount

Factory Lead Time :

18 Weeks

Package / Case :

DO-214AB, SMC

Number of Elements :

1

Terminal Finish :

Matte Tin (Sn)

Operating Temperature :

-65°C~150°C TJ

Peak Reflow Temperature (Cel) :

260

Voltage - Breakdown (Min) :

33.3V

Unidirectional Channels :

1

Pin Count :

2

RoHS Status :

Non-RoHS Compliant

Time@Peak Reflow Temperature-Max (s) :

40

Terminal Form :

J BEND

Published :

1997

Terminal Position :

Dual

Clamping Voltage :

48.4V

Power Line Protection :

No

Type :

Zener

Additional Feature :

High Reliability

Pbfree Code :

yes

Max Reverse Leakage Current :

1μA

Diode Element Material :

SILICON

Direction :

Unidirectional

Reverse Standoff Voltage :

30V

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Peak Pulse Power :

1.5kW

Power - Peak Pulse :

1500W 1.5kW

Applications :

GENERAL PURPOSE

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Mounting Type :

Surface Mount

Element Configuration :

Single

JESD-609 Code :

e3

Packaging :

Bulk

Peak Pulse Current :

31A

Number of Pins :

2

Test Current :

1mA

Series :

Military, MIL-PRF-19500

ECCN Code :

EAR99

Number of Terminations :

2