MXLSMBJ18CA

Manufacturer :

Microchip Technology

Product Category :

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Terminal Finish :

Tin/Lead (Sn/Pb)

Max Reverse Leakage Current :

1μA

Test Current :

1mA

Bidirectional Channels :

1

Power Line Protection :

No

Operating Temperature :

-65°C~150°C TJ

Peak Pulse Current :

20.5A

Peak Pulse Power :

600W

Package / Case :

DO-214AA, SMB

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Pins :

2

Packaging :

Bulk

RoHS Status :

Non-RoHS Compliant

Voltage - Breakdown (Min) :

20V

Terminal Position :

Dual

Number of Elements :

1

Clamping Voltage :

29.2V

Terminal Form :

J BEND

JESD-609 Code :

e0

Series :

Military, MIL-PRF-19500

ECCN Code :

EAR99

Published :

1997

Mount :

Surface Mount

Mounting Type :

Surface Mount

Diode Element Material :

SILICON

Applications :

GENERAL PURPOSE

Pbfree Code :

No

Pin Count :

2

Reverse Standoff Voltage :

18V

Breakdown Voltage :

21.05V

Direction :

Bidirectional

Additional Feature :

High Reliability

Type :

Zener

Element Configuration :

Single

Number of Terminations :

2

Power - Peak Pulse :

600W