MX30UF4G18AB-TI
- Mfr.Part #
- MX30UF4G18AB-TI
- Manufacturer
- Macronix
- Package / Case
- Datasheet
- Download
- Description
- IC FLASH 4GBIT PARALLEL 48TSOP
- Stock
- 21,428
- In Stock :
- 21,428
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- Manufacturer :
- Macronix
- Product Category :
- Memory
- Programming Voltage :
- 1.8V
- RoHS Status :
- RoHS Compliant
- Length :
- 18.4mm
- Terminal Pitch :
- 0.5mm
- JESD-609 Code :
- e3
- Packaging :
- Tray
- JESD-30 Code :
- R-PDSO-G48
- Peak Reflow Temperature (Cel) :
- 260
- Width :
- 12mm
- ECCN Code :
- 3A991.B.1.A
- Terminal Position :
- Dual
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Memory Width :
- 8
- Number of Functions :
- 1
- Supply Voltage-Max (Vsup) :
- 1.95V
- Supply Voltage :
- 1.8V
- Memory Density :
- 4294967296 bit
- Parallel/Serial :
- Parallel
- Supply Voltage-Min (Vsup) :
- 1.7V
- Number of Terminations :
- 48
- Terminal Finish :
- Matte Tin (Sn)
- Organization :
- 512MX8
- Operating Temperature (Min) :
- -40°C
- Height Seated (Max) :
- 1.2mm
- Surface Mount :
- yes
- Terminal Form :
- Gull wing
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.32.00.51
- Temperature Grade :
- Industrial
- Operating Mode :
- ASYNCHRONOUS
- Memory IC Type :
- Flash
- Operating Temperature (Max) :
- 85°C
- Datasheets
- MX30UF4G18AB-TI

Memory Macronix MX30UF4G18AB-TI Overview
The Memory Macronix MX30UF4G18AB-TI is a high-capacity, parallel interface NAND flash memory module, designed for applications that demand significant data storage and high-speed data access. This IC FLASH integrates 4Gbit of memory in a compact 48TSOP package, making it an excellent choice for enhancing embedded solutions. Its robust storage capacity and reliability make it especially suitable for industrial applications where long-term data integrity and performance are crucial. The integration of advanced memory technology by Macronix ensures that this product offers both high efficiency and durability, essential for modern industrial applications. This component is particularly designed to meet the rigorous demands of both commercial and industrial environments, ensuring both scalability and performance enhancements in a variety of applications.
MX30UF4G18AB-TI Features
The MX30UF4G18AB-TI features a parallel interface for high-speed data transfer, a 4Gbit storage capacity, and a standard 48TSOP packaging. It supports a wide range of operating temperatures, making it versatile for different environmental conditions. The NAND flash technology used in this memory device provides a reliable solution for data-intensive applications, offering enhanced endurance and improved power efficiency compared to traditional NOR flash.
MX30UF4G18AB-TI Applications
- Consumer Electronics: Utilized in devices such as digital cameras and audio players, where large storage capacities are necessary for user media and data.
- Embedded Systems: Acts as a core component in embedded industrial applications, including robotics and automotive systems, where robust memory is crucial for logging data and firmware updates.
- Mobile Technology: Provides the storage backbone for mobile phones and tablets, supporting the high performance needed for apps, media storage, and operating system requirements.
- Networking Equipment: Used in routers and network switches for firmware storage and management, ensuring high-speed access and reliability under continuous operation.
- Internet of Things (IoT) Devices: Ideal for smart home devices and IoT gateways, where the reliable storage of user settings and application data is critical for device functionality and user experience.
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