MX30UF4G18AB-TI

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Mfr.Part #
MX30UF4G18AB-TI
Manufacturer
Macronix
Package / Case
Datasheet
Download
Description
IC FLASH 4GBIT PARALLEL 48TSOP
Stock
21,428
In Stock :
21,428

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Manufacturer :
Macronix
Product Category :
Memory
HTS Code :
8542.32.00.51
Operating Mode :
ASYNCHRONOUS
Height Seated (Max) :
1.2mm
Terminal Finish :
Matte Tin (Sn)
RoHS Status :
RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Pitch :
0.5mm
ECCN Code :
3A991.B.1.A
Peak Reflow Temperature (Cel) :
260
Surface Mount :
yes
Number of Functions :
1
Memory IC Type :
Flash
Memory Width :
8
Number of Terminations :
48
Operating Temperature (Min) :
-40°C
JESD-609 Code :
e3
Operating Temperature (Max) :
85°C
Terminal Position :
Dual
Supply Voltage :
1.8V
Packaging :
Tray
Supply Voltage-Max (Vsup) :
1.95V
Organization :
512MX8
Parallel/Serial :
Parallel
Supply Voltage-Min (Vsup) :
1.7V
Programming Voltage :
1.8V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Gull wing
JESD-30 Code :
R-PDSO-G48
Length :
18.4mm
Temperature Grade :
Industrial
Width :
12mm
Memory Density :
4294967296 bit
Datasheets
MX30UF4G18AB-TI
Introducing Memory Macronix MX30UF4G18AB-TI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:48, MX30UF4G18AB-TI pinout, MX30UF4G18AB-TI datasheet PDF, MX30UF4G18AB-TI amp .Beyond Memory Macronix MX30UF4G18AB-TI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Macronix MX30UF4G18AB-TI


Memory Macronix MX30UF4G18AB-TI Overview

The Memory Macronix MX30UF4G18AB-TI is a high-capacity, parallel interface NAND flash memory module, designed for applications that demand significant data storage and high-speed data access. This IC FLASH integrates 4Gbit of memory in a compact 48TSOP package, making it an excellent choice for enhancing embedded solutions. Its robust storage capacity and reliability make it especially suitable for industrial applications where long-term data integrity and performance are crucial. The integration of advanced memory technology by Macronix ensures that this product offers both high efficiency and durability, essential for modern industrial applications. This component is particularly designed to meet the rigorous demands of both commercial and industrial environments, ensuring both scalability and performance enhancements in a variety of applications.

MX30UF4G18AB-TI Features

The MX30UF4G18AB-TI features a parallel interface for high-speed data transfer, a 4Gbit storage capacity, and a standard 48TSOP packaging. It supports a wide range of operating temperatures, making it versatile for different environmental conditions. The NAND flash technology used in this memory device provides a reliable solution for data-intensive applications, offering enhanced endurance and improved power efficiency compared to traditional NOR flash.

MX30UF4G18AB-TI Applications

  • Consumer Electronics: Utilized in devices such as digital cameras and audio players, where large storage capacities are necessary for user media and data.
  • Embedded Systems: Acts as a core component in embedded industrial applications, including robotics and automotive systems, where robust memory is crucial for logging data and firmware updates.
  • Mobile Technology: Provides the storage backbone for mobile phones and tablets, supporting the high performance needed for apps, media storage, and operating system requirements.
  • Networking Equipment: Used in routers and network switches for firmware storage and management, ensuring high-speed access and reliability under continuous operation.
  • Internet of Things (IoT) Devices: Ideal for smart home devices and IoT gateways, where the reliable storage of user settings and application data is critical for device functionality and user experience.
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