MX29GL512FHXGI-10Q
- Mfr.Part #
- MX29GL512FHXGI-10Q
- Manufacturer
- Macronix
- Package / Case
- TFBGA
- Datasheet
- Download
- Description
- IC FLASH 512MBIT PARALLEL 56FBGA
- Stock
- 7,530
- In Stock :
- 7,530
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- Manufacturer :
- Macronix
- Product Category :
- Memory
- Supply Voltage-Min (Vsup) :
- 3V
- Memory Density :
- 536870912 bit
- Max Operating Temperature :
- 85°C
- Operating Mode :
- ASYNCHRONOUS
- Width :
- 7mm
- Memory Width :
- 16
- Time@Peak Reflow Temperature-Max (s) :
- 40
- JESD-30 Code :
- R-PBGA-B56
- Programming Voltage :
- 3V
- Supply Voltage :
- 3.3V
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Pitch :
- 0.5mm
- Length :
- 9mm
- Min Operating Temperature :
- -40°C
- Package / Case :
- TFBGA
- RoHS Status :
- RoHS Compliant
- Terminal Form :
- Ball
- Access Time (Max) :
- 100 ns
- Number of Functions :
- 1
- Height Seated (Max) :
- 1.2mm
- Number of Terminations :
- 56
- Surface Mount :
- yes
- Temperature Grade :
- Industrial
- Alternate Memory Width :
- 8
- Terminal Position :
- BOTTOM
- Interface :
- Parallel
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Type :
- FLASH, NOR
- Organization :
- 32MX16
- Datasheets
- MX29GL512FHXGI-10Q
Memory IC 9mm mm
MX29GL512FHXGI-10Q Overview
FLASH, NOR is the type of memory it has. The TFBGA case contains it. The chip has 56 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3.3V of power. This device must operate at a minimum temperature of -40°C. Temperatures no higher than 85°C degrees Celsius are recommended for operation. Nonvolatile memory arrays require 3V programming voltage to change their state.
MX29GL512FHXGI-10Q Features
Package / Case: TFBGA
MX29GL512FHXGI-10Q Applications
There are a lot of Macronix
MX29GL512FHXGI-10Q Memory applications.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
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