MX29GL256FDT2I-11G
- Mfr.Part #
- MX29GL256FDT2I-11G
- Manufacturer
- Macronix
- Package / Case
- 56-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- IC FLASH 256MBIT PARALLEL 56TSOP
- Stock
- 34,231
- In Stock :
- 34,231
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- Manufacturer :
- Macronix
- Product Category :
- Memory
- Write Cycle Time - Word, Page :
- 110ns
- Lead Free :
- Lead Free
- Memory Width :
- 16
- Sector Size :
- 128K
- Height Seated (Max) :
- 1.2mm
- Power Supplies :
- 3/3.3V
- Operating Supply Voltage :
- 3.6V
- Qualification Status :
- Not Qualified
- Length :
- 18.4mm
- Terminal Pitch :
- 0.5mm
- Alternate Memory Width :
- 8
- Supply Voltage :
- 3V
- Access Time (Max) :
- 110 ns
- JESD-30 Code :
- R-PDSO-G56
- Number of Sectors/Size :
- 256
- Density :
- 256 Mb
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Min (Vsup) :
- 2.7V
- Memory Interface :
- Parallel
- Programming Voltage :
- 3V
- Common Flash Interface :
- yes
- Surface Mount :
- yes
- Supply Current-Max :
- 0.03mA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Type :
- Non-Volatile
- Memory Size :
- 256Mb 32M x 8
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~85°C TA
- Standby Current-Max :
- 0.00001A
- Toggle Bit :
- yes
- Series :
- MX29GL
- Page Size :
- 8/16words
- Ready/Busy :
- yes
- Data Polling :
- yes
- Organization :
- 16MX16
- Width :
- 14mm
- Voltage - Supply :
- 2.7V~3.6V
- Number of Terminations :
- 56
- Command User Interface :
- yes
- Terminal Position :
- Dual
- ECCN Code :
- 3A991.B.1.A
- Memory Format :
- Flash
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Operating Mode :
- ASYNCHRONOUS
- Package / Case :
- 56-TFSOP (0.724, 18.40mm Width)
- Published :
- 2015
- HTS Code :
- 8542.32.00.51
- Factory Lead Time :
- 10 Weeks
- Pin Count :
- 56
- Number of Functions :
- 1
- Datasheets
- MX29GL256FDT2I-11G

Memory Macronix MX29GL256FDT2I-11G Overview
As a leading product expert in integrated circuits, I'm thrilled to introduce the Macronix MX29GL256FDT2I-11G Flash IC, a cutting-edge solution tailored for demanding applications. This flash memory device boasts a capacity of 256MB and operates in parallel, housed in a compact 56TSOP package. Designed by Macronix, a reputable manufacturer renowned for its innovation and reliability in the semiconductor industry, this IC delivers unparalleled performance and durability.
MX29GL256FDT2I-11G Features
- High Capacity: With a storage capacity of 256MB, this flash IC accommodates vast amounts of data, ideal for memory-intensive applications.
- Parallel Interface: The parallel interface facilitates fast data transfer, ensuring efficient operation in various systems.
- Compact Design: Housed in a 56TSOP package, this IC offers a compact footprint, suitable for space-constrained designs.
- Durable Construction: Built with quality materials and advanced manufacturing processes, this Macronix IC guarantees long-term reliability and robust performance.
- Wide Application Compatibility: Compatible with a wide range of devices and systems, this flash memory IC is versatile and adaptable to diverse applications.
MX29GL256FDT2I-11G Applications
- Embedded Systems: This flash IC is commonly used in embedded systems such as industrial control systems, automotive electronics, and consumer electronics, where reliable and high-capacity storage is essential for data logging, firmware storage, and system booting.
- Networking Equipment: In networking devices such as routers, switches, and access points, the MX29GL256FDT2I-11G facilitates firmware storage, configuration storage, and logging, ensuring seamless operation and efficient data management.
- Telecommunications: Telecommunication infrastructure relies on flash memory for storing firmware, configuration data, and logs. The Macronix MX29GL256FDT2I-11G excels in this domain, offering high-speed data access and reliable storage for telecom applications.
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