MX25U25635FXDI-10G
- Mfr.Part #
- MX25U25635FXDI-10G
- Manufacturer
- Macronix
- Package / Case
- Datasheet
- Download
- Description
- IC FLASH 256MBIT SPI/QU 24CSPBGA
- Stock
- 16,235
- In Stock :
- 16,235
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- Manufacturer :
- Macronix
- Product Category :
- Memory
- Height Seated (Max) :
- 1.2mm
- Programming Voltage :
- 1.8V
- Memory IC Type :
- Flash
- Supply Voltage-Min (Vsup) :
- 1.65V
- Packaging :
- Tray
- Operating Temperature (Max) :
- 85°C
- Supply Voltage :
- 1.8V
- Width :
- 6mm
- Additional Feature :
- ALSO CONFIGURABLE AS 256MX1
- Published :
- 2017
- Clock Frequency :
- 108MHz
- Memory Width :
- 4
- Number of Terminations :
- 24
- JESD-30 Code :
- R-PBGA-B24
- Terminal Position :
- BOTTOM
- Operating Mode :
- SYNCHRONOUS
- Parallel/Serial :
- Serial
- Organization :
- 64MX4
- Alternate Memory Width :
- 2
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- RoHS Compliant
- Terminal Form :
- Ball
- Supply Voltage-Max (Vsup) :
- 3.6V
- Length :
- 8mm
- Terminal Pitch :
- 1mm
- Number of Functions :
- 1
- Memory Density :
- 268435456 bit
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Operating Temperature (Min) :
- -40°C
- Temperature Grade :
- Industrial
- Datasheets
- MX25U25635FXDI-10G

Memory Macronix MX25U25635FXDI-10G Overview
Introducing the Memory Macronix MX25U25635FXDI-10G, a high-performance 256Mbit SPI/QUAD SPI flash IC, expertly crafted by Macronix, a leader in integrated circuit technology. This IC is designed to meet the rigorous demands of modern applications, delivering reliable data storage with high speed and flexibility. Its compact 24CSPBGA package ensures seamless integration into various electronic assemblies, making it an ideal choice for manufacturers aiming to enhance their systems with efficient, high-capacity memory solutions.
MX25U25635FXDI-10G Features
The MX25U25635FXDI-10G flash memory chip boasts a range of features that make it a superior choice for sophisticated electronics. These include its SPI/QUAD SPI interface options which allow for versatile connection and faster data throughput, essential for high-speed operations. The chip's 256Mbit capacity provides ample space for large volumes of data, while its compact BGA package ensures minimal real estate usage on PCBs, crucial for modern, space-conscious designs.
MX25U25635FXDI-10G Applications
- Consumer Electronics: Used in devices like smartphones, tablets, and digital cameras where high-density, reliable storage is critical.
- Automotive Applications: Integrated into automotive infotainment systems to manage data logging, GPS maps, and multimedia content efficiently.
- Internet of Things (IoT): Provides the storage backbone for IoT devices, enabling enhanced device firmware and data management for smart home systems and wearables.
- Industrial: Serves as a dependable storage solution in industrial automation systems, facilitating advanced machine programming and data acquisition tasks.
- Telecommunications: Critical for data retention in communication equipment, supporting enhanced network configurations and user-specific settings.
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