MTMM-110-15-S-D-771

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Mfr.Part #
MTMM-110-15-S-D-771
Manufacturer
Samtec, Inc.
Package / Case
Datasheet
Download
Description
CONN HEADER VERT 20POS 2MM
Stock
23,761
In Stock :
23,761

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Manufacturer :
Samtec, Inc.
Product Category :
Headers, Male Pins
Pitch - Mating :
0.079 2.00mm
Row Spacing - Mating :
0.079 (2.00mm)
Packaging :
Bulk
Contact Shape :
Square
JESD-609 Code :
e3
Current Rating (Amps) :
3A
Contact Finish Thickness - Mating :
30.0μin 0.76μm
Insulation Height :
0.059 1.50mm
Radiation Hardening :
No
Gender :
Male
RoHS Status :
ROHS3 Compliant
Number of Positions Loaded :
All
Insulation Color :
Black
Mount :
Through Hole
MIL Conformance :
No
Filter Feature :
No
Contact Finish - Post :
Tin
Termination :
Solder
Number of Rows :
2
Mounting Type :
Through Hole
Number of Positions :
20
DIN Conformance :
No
Factory Lead Time :
3 Weeks
Mixed Contacts :
No
Contact Material :
Phosphor Bronze
IEC Conformance :
No
Operating Temperature :
-55°C~125°C
Style :
Board to Board or Cable
Option :
GENERAL PURPOSE
Connector Type :
Header, Cuttable
Fastening Type :
Push-Pull
Shrouding :
Unshrouded
Insulation Material :
Liquid Crystal Polymer (LCP)
Total Number of Contacts :
20
Contact Type :
Male Pin
Pbfree Code :
yes
Series :
MTMM
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Contact Length - Mating :
0.771 19.58mm
Overall Contact Length :
0.830 21.08mm
Contact Finish - Mating :
Gold
Material Flammability Rating :
UL94 V-0
Datasheets
MTMM-110-15-S-D-771
Introducing Headers, Male Pins Samtec, Inc. MTMM-110-15-S-D-771 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-55°C~125°C, MTMM-110-15-S-D-771 pinout, MTMM-110-15-S-D-771 datasheet PDF, MTMM-110-15-S-D-771 amp .Beyond Headers, Male Pins Samtec, Inc. MTMM-110-15-S-D-771 ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.



MTMM Series 2-Row Header, Cuttable Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 20-Position Board to Board or Cable 0.059 1.50mm Height

MTMM-110-15-S-D-771 Overview


Packaging for this item is Header, Cuttable.There is a mounting type of Through Hole for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the MTMM Series.Through Hole is used to mount the part.In this case, the device operates at -55°C~125°C Operating Temperature.

MTMM-110-15-S-D-771 Features


MTMM series


MTMM-110-15-S-D-771 Applications


There are a lot of Samtec Inc.
MTMM-110-15-S-D-771 Rectangular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
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RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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