MT8985AP1

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Mfr.Part #
MT8985AP1
Manufacturer
Microchip Technology
Package / Case
44-LCC (J-Lead)
Datasheet
Download
Description
IC TELECOM INTERFACE 44PLCC
Stock
37,192
In Stock :
37,192

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Mounting Type :
Surface Mount
Pbfree Code :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
4.75V~5.25V
Height Seated (Max) :
4.57mm
Supplier Device Package :
44-PLCC (16.59x16.59)
Product Status :
Obsolete
Peak Reflow Temperature (Cel) :
260
Packaging :
Tube
Max Supply Current :
10mA
Operating Supply Voltage :
5V
Terminal Pitch :
1.27 mm
Terminal Finish :
MATTE TIN
Power Supplies :
5V
Operating Temperature :
-40°C~85°C
Package / Case :
44-LCC (J-Lead)
Pin Count :
44
Number of Terminals :
44
Number of Pins :
44
Length :
16.585 mm
Number of Circuits :
1
Seated Height-Max :
4.57 mm
Terminal Form :
J BEND
Package :
Tube
Supply Voltage :
5V
Switch Core :
Non-Blocking
Fabric Size :
256 X 256
RoHS Status :
ROHS3 Compliant
Number of Ports :
8
Factory Lead Time :
7 Weeks
Radiation Hardening :
No
Number of Terminations :
44
JESD-609 Code :
e3
Package Shape :
Square
Operating Supply Voltage (Max) :
5.25(V)
Surface Mount :
yes
Operating Supply Current :
10mA
Manufacturer :
Microsemi Corporation
Series :
-
Temperature Grade :
Industrial
Function :
Switch
HTS Code :
8542.39.00.01
Max Power Dissipation :
2W
Reach Compliance Code :
Compliant
Package Type :
PLCC
Published :
2006
JESD-30 Code :
S-PQCC-J44
Operating Supply Voltage (Min) :
4.75(V)
Interface :
-
Time@Peak Reflow Temperature-Max (s) :
30
Number of Functions :
1
Width :
16.585 mm
Port Speed :
2.048Mbps
Operating Temp Range :
85C
Qualification Status :
Not Qualified
Supply Current-Max :
15 mA
Weight :
2.386605g
Terminal Position :
QUAD
Mount :
Surface Mount
Current - Supply :
10mA
Telecom IC Type :
DIGITAL TIME SWITCH
Datasheets
MT8985AP1
Introducing Telecom Microchip Technology MT8985AP1 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, Package / Case:44-LCC (J-Lead), Number of Pins:44, Number of Terminations:44, MT8985AP1 pinout, MT8985AP1 datasheet PDF, MT8985AP1 amp .Beyond Telecom Microchip Technology MT8985AP1 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MT8985AP1


Telecom Microchip Technology MT8985AP1 Overview

The Telecom Microchip Technology MT8985AP1 is a state-of-the-art Integrated Circuit specifically designed for telecom interface applications. This IC, encased in a 44PLCC package, serves as a robust platform for developing telecommunications equipment. The product is engineered by Microchip Technology, a leader in semiconductor technology, ensuring high reliability and performance. The MT8985AP1 is ideal for manufacturers and developers looking to enhance their communications infrastructure with a scalable and efficient solution that promises not only longevity but also superior functionality in demanding environments.

MT8985AP1 Features

This IC features multiple functionalities tailored for the telecommunications sector. It includes advanced signal processing capabilities, low power consumption, and high integration that facilitates compact designs. Additionally, its compatibility with various communication protocols enhances its versatility in deployment across different telecom systems, ensuring a broad application scope and adaptability.

MT8985AP1 Applications

  • Telecommunication Switching Systems: Utilized in the core of telecom infrastructure to manage and route calls efficiently across networks.
  • VoIP Gateways: Essential in converting voice from an analog phone system to digital packets for transmission over the Internet, enhancing the clarity and speed of voice communications.
  • Wireless Base Stations: Supports signal processing tasks necessary for the operation of cellular base stations, facilitating improved connectivity and bandwidth management.
  • Integrated Access Devices: Used in devices that consolidate multiple communication services, such as voice and data, providing a unified platform that simplifies telecommunications architecture.
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