MT61K256M32JE-12:A

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Mfr.Part #
MT61K256M32JE-12:A
Manufacturer
Micron Technology
Package / Case
180-TFBGA
Datasheet
Download
Description
IC RAM 8GBIT PARALLEL 180FBGA
Stock
43,438
In Stock :
43,438

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Manufacturer :
Micron Technology
Product Category :
Memory
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) :
260
JESD-609 Code :
e1
Supply Voltage :
1.25V
Memory Size :
8Gb 256M x 32
Additional Feature :
AUTO/SELF REFRESH
Memory Interface :
Parallel
Memory Density :
8589934592 bit
Access Mode :
MULTI BANK PAGE BURST
Package / Case :
180-TFBGA
Memory Type :
Volatile
Memory Width :
32
Number of Terminations :
180
Clock Frequency :
1.5GHz
Surface Mount :
yes
Reach Compliance Code :
Compliant
Organization :
256MX32
Terminal Pitch :
0.75mm
Voltage - Supply :
1.31V~1.39V
Operating Mode :
SYNCHRONOUS
Supply Voltage-Min (Vsup) :
1.2125V
Terminal Position :
BOTTOM
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
RoHS Compliant
Supply Voltage-Max (Vsup) :
1.2875V
Number of Functions :
1
Width :
12mm
JESD-30 Code :
R-PBGA-B180
Length :
14mm
Memory Format :
RAM
Mounting Type :
Sub-Base Mount
Number of Ports :
1
Height Seated (Max) :
1.2mm
Operating Temperature :
0°C~95°C TC
Introducing Memory Micron Technology MT61K256M32JE-12:A from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:180-TFBGA, Number of Terminations:180, Mounting Type:Sub-Base Mount, Operating Temperature:0°C~95°C TC, MT61K256M32JE-12:A pinout, MT61K256M32JE-12:A datasheet PDF, MT61K256M32JE-12:A amp .Beyond Memory Micron Technology MT61K256M32JE-12:A ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT61K256M32JE-12:A


Memory Micron Technology MT61K256M32JE-12:A Overview

The Memory Micron Technology MT61K256M32JE-12:A is an advanced 8Gbit DRAM module designed by Micron Technology, one of the leading innovators in memory and storage solutions. This integrated circuit (IC) is encapsulated in a compact 180-ball fine-pitch BGA package, designed to deliver high-speed performance and substantial data bandwidth for demanding applications. The IC's parallel interface and high capacity make it ideal for expanding the memory in a range of high-performance computing environments. Its robust data management and storage capabilities are tailored to meet the rigorous demands of both current and next-generation platforms, ensuring efficiency and reliability.

MT61K256M32JE-12:A Features

This DRAM module is engineered with a focus on speed and scalability, supporting a wide array of high-speed data processing tasks. Key features include a parallel interface for improved data transfer rates, a large 8Gbit capacity for extensive data handling, and a compact 180FBGA package that ensures a minimal footprint on system boards, promoting better system design and thermal management.

MT61K256M32JE-12:A Applications

  • High-Performance Computing (HPC): Utilizes the high bandwidth and speed to manage and process large datasets efficiently, suitable for scientific research and simulations.
  • Enterprise Servers: Enhances server capabilities in data centers by providing high-density, reliable memory storage that supports extensive multitasking and virtualization.
  • Networking Infrastructure: Supports the robust memory requirements of network devices such as routers and switches, enabling faster processing of large volumes of data and improving network efficiency.
  • Video Streaming Servers: Facilitates smooth and uninterrupted video streaming by accommodating large-scale video content processing and storage.
  • Gaming Consoles: Improves gaming experiences by providing fast, high-capacity memory essential for complex game designs and enhanced graphics rendering.
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