MT53D1024M32D4NQ-046 AAT ES :D

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Mfr.Part #
MT53D1024M32D4NQ-046 AAT ES :D
Manufacturer
Micron Technology
Package / Case
200-VFBGA
Datasheet
Download
Description
IC DRAM 32GBIT 2133MHZ 200VFBGA
Stock
3,554
In Stock :
3,554

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
-40°C~105°C TA
Clock Frequency :
2133MHz
Voltage - Supply :
1.1V
Memory Format :
DRAM
Package / Case :
200-VFBGA
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Memory Size :
32Gb 1G x 32
Memory Type :
Volatile
Introducing Memory Micron Technology MT53D1024M32D4NQ-046 AAT ES :D from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~105°C TA, Package / Case:200-VFBGA, Mounting Type:Surface Mount, MT53D1024M32D4NQ-046 AAT ES :D pinout, MT53D1024M32D4NQ-046 AAT ES :D datasheet PDF, MT53D1024M32D4NQ-046 AAT ES :D amp .Beyond Memory Micron Technology MT53D1024M32D4NQ-046 AAT ES :D ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D1024M32D4NQ-046 AAT ES :D


Memory Micron Technology MT53D1024M32D4NQ-046 AAT ES :D Overview

Introducing the Memory Micron Technology MT53D1024M32D4NQ-046 AAT ES :D, a cutting-edge IC DRAM component engineered by Micron Technology, specifically designed to meet the rigorous demands of high-capacity, high-speed data processing environments. With a staggering 32Gbit density and a fast 2133MHz speed, this 200VFBGA packaged memory module is ideal for applications requiring extensive data bandwidth and storage. Its robust architecture and superior reliability make it an essential component for advanced computing systems looking to leverage large-scale memory capabilities.

MT53D1024M32D4NQ-046 AAT ES :D Features

This dynamic memory chip offers a high-density 32GBIT configuration, ensuring substantial data handling and storage capabilities. The 2133MHz operational speed enhances processing efficiency, reducing latency in critical computing tasks. Its compact 200VFBGA packaging is designed for optimized thermal management and space efficiency, making it perfect for integration into a variety of hardware platforms.

MT53D1024M32D4NQ-046 AAT ES :D Applications

  • Enterprise Servers and Data Centers: Provides the backbone for high-speed, high-volume data processing and storage, enabling robust server performance and reliability in demanding IT environments.
  • High-Performance Computing (HPC): Ideal for scientific research, simulation, and cryptographic computations where large data sets are processed in parallel, maximizing computational speed and efficiency.
  • Networking Infrastructure: Supports advanced networking equipment, including routers and switches, to manage bandwidth-intensive applications while maintaining fast data transfer rates.
  • Telecommunications: Enhances the capabilities of telecommunications equipment, ensuring rapid processing of data for improved signal integrity and quicker response times in network operations.
  • Consumer Electronics: Used in high-end gaming consoles and computer systems to manage and execute large and complex graphics data swiftly, providing an immersive gaming experience.
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