MT29F8G08ABACAH4-ITS:C

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Mfr.Part #
MT29F8G08ABACAH4-ITS:C
Manufacturer
Micron Technology
Package / Case
63-VFBGA
Datasheet
Download
Description
IC FLASH 8GBIT PARALLEL 63VFBGA
Stock
19,630
In Stock :
19,630

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
63-VFBGA
Memory Size :
8Gb 1G x 8
Supplier Device Package :
63-VFBGA (9x11)
Voltage - Supply :
2.7V~3.6V
Operating Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Memory Format :
Flash
Memory Type :
Non-Volatile
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Operating Temperature :
-40°C~85°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Introducing Memory Micron Technology MT29F8G08ABACAH4-ITS:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:63-VFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, MT29F8G08ABACAH4-ITS:C pinout, MT29F8G08ABACAH4-ITS:C datasheet PDF, MT29F8G08ABACAH4-ITS:C amp .Beyond Memory Micron Technology MT29F8G08ABACAH4-ITS:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F8G08ABACAH4-ITS:C


Memory Micron Technology MT29F8G08ABACAH4-ITS:C Overview

Introducing the Memory Micron Technology MT29F8G08ABACAH4-ITS:C, a high-capacity, parallel interface NAND Flash memory component designed to meet the sophisticated demands of modern technology applications. Manufactured by Micron Technology, this IC FLASH 8GBIT device is encapsulated in a compact 63VFBGA package, enabling dense board layouts and minimizing footprint. Engineered to deliver reliable data storage and quick access times, this product stands out in the market for both its performance efficiency and durability.

MT29F8G08ABACAH4-ITS:C Features

The MT29F8G08ABACAH4-ITS:C Flash memory boasts several distinctive features, including its 8 Gbit density which offers ample storage for large-scale applications. Its parallel interface ensures high-speed data transfer rates, which is essential for systems requiring quick read and write operations. The 63VFBGA package is not only space-efficient but also conducive for advanced PCB design and manufacturing, facilitating enhanced thermal management and reliability under varying operational conditions.

MT29F8G08ABACAH4-ITS:C Applications

  • Embedded Systems: Utilized in the core memory component for embedded systems, where durability and reliable data integrity are crucial.
  • Consumer Electronics: Ideal for use in devices such as tablets, e-readers, and high-end cameras, providing the necessary storage capacity and fast access to data.
  • Automotive Applications: Employed in advanced driver-assistance systems (ADAS) where robust memory storage solutions are needed for real-time data processing.
  • Industrial Automation: Serves as a critical component in automation machinery and industrial PCs, ensuring stable and enduring performance in tough environments.
  • Networking: Applied in networking hardware like routers and switches, supporting the storage demands of firmware and system-level functions.
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