MT29F8G08ABACAH4:C TR

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Mfr.Part #
MT29F8G08ABACAH4:C TR
Manufacturer
Micron Technology
Package / Case
63-VFBGA
Datasheet
Download
Description
IC FLASH 8GBIT PARALLEL 63VFBGA
Stock
25,803
In Stock :
25,803

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
8Gb 1G x 8
Base Part Number :
MT29F8G08
Factory Lead Time :
4 Weeks
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Memory Type :
Non-Volatile
Published :
2015
Packaging :
Tape and Reel (TR)
Memory Format :
Flash
Package / Case :
63-VFBGA
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
2.7V~3.6V
Introducing Memory Micron Technology MT29F8G08ABACAH4:C TR from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:MT29F8G08, Mounting Type:Surface Mount, Package / Case:63-VFBGA, Operating Temperature:0°C~70°C TA, MT29F8G08ABACAH4:C TR pinout, MT29F8G08ABACAH4:C TR datasheet PDF, MT29F8G08ABACAH4:C TR amp .Beyond Memory Micron Technology MT29F8G08ABACAH4:C TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F8G08ABACAH4:C TR


Memory Micron Technology MT29F8G08ABACAH4:C TR Overview

The Memory Micron Technology MT29F8G08ABACAH4:C TR is a high-performance 8 Gbit NAND flash memory component encapsulated in a compact 63-VFBGA package. Engineered by Micron Technology, this IC is designed for robust parallel interface applications, offering high-density data storage solutions. The chip is ideally suited for applications requiring high-speed data processing and substantial storage capacity. Its reliability and efficiency make it an excellent choice for enterprise-level solutions needing mass storage options with sustained performance and integrity.

MT29F8G08ABACAH4:C TR Features

This IC FLASH features an 8 Gbit storage capacity with a parallel interface for enhanced data transfer speeds and reduced latency. The 63-VFBGA package is optimized for reduced space consumption while allowing for efficient thermal management, making it suitable for densely packed electronic assemblies. Additionally, the device supports a wide range of operating temperatures, ensuring reliability in various environmental conditions.

MT29F8G08ABACAH4:C TR Applications

  • Consumer Electronics: Utilized in smartphones and tablets to provide high-density, reliable storage solutions that enhance device performance and multimedia storage capabilities.
  • Embedded Systems: Deployed in automotive and industrial applications for data logging and firmware updates, ensuring robust operation in harsh environments.
  • Enterprise Storage Solutions: Ideal for data centers requiring solid-state drives (SSDs) that offer rapid access to large volumes of data with high reliability and endurance.
  • Portable Media Players: Used in devices requiring extensive memory for media storage, facilitating long hours of audio and video playback without compromising speed or quality.
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Shipping Cost

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