MT29F768G08EECBBJ4-37:B TR

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Mfr.Part #
MT29F768G08EECBBJ4-37:B TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 768GBIT PAR 132VBGA
Stock
36,261
In Stock :
36,261

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
768Gb 96G x 8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Non-Volatile
Voltage - Supply :
2.7V~3.6V
Packaging :
Tape and Reel (TR)
Clock Frequency :
267MHz
Package / Case :
132-VBGA
RoHS Status :
ROHS3 Compliant
Memory Format :
Flash
Operating Temperature :
0°C~70°C TA
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Introducing Memory Micron Technology MT29F768G08EECBBJ4-37:B TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:132-VBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, MT29F768G08EECBBJ4-37:B TR pinout, MT29F768G08EECBBJ4-37:B TR datasheet PDF, MT29F768G08EECBBJ4-37:B TR amp .Beyond Memory Micron Technology MT29F768G08EECBBJ4-37:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F768G08EECBBJ4-37:B TR


Memory Micron Technology MT29F768G08EECBBJ4-37:B TR Overview

The Memory Micron Technology MT29F768G08EECBBJ4-37:B TR is an advanced IC FLASH memory component, engineered by Micron Technology, that offers a substantial storage capacity of 768 Gbit. Designed in a compact 132VBGA package, this flash memory IC provides robust data integrity and high-speed performance, making it an essential component for high-volume storage applications. The durability and efficiency of the MT29F768G08EECBBJ4-37:B TR make it an excellent choice for developers and manufacturers aiming to leverage high capacity memory solutions in their products.

MT29F768G08EECBBJ4-37:B TR Features

This flash memory chip comes equipped with numerous features conducive to enhancing system reliability and performance. Key features include its parallel interface, which ensures high data transfer speeds and seamless integration with existing architectures. Additionally, its BGA (Ball Grid Array) packaging not only aids in efficient heat dissipation but also minimizes footprint on PCBs, thus supporting more compact device designs.

MT29F768G08EECBBJ4-37:B TR Applications

  • Enterprise Storage Solutions: Used in data centers and cloud storage infrastructures to handle massive volumes of data with reliability and speed.
  • High-End Mobile Devices: Provides the necessary storage capacity and speed for smartphones and tablets, enhancing user experience with fast access to large multimedia files and applications.
  • Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to store and process large amounts of data in real time, contributing to vehicle safety and performance enhancements.
  • Embedded Systems: Ideal for use in industrial automation and IoT devices, where long-term reliability and high-density storage are crucial.
  • Gaming Consoles: Enables high-performance gaming experiences by accommodating extensive game data and rapid loading times.
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IMPORTANT NOTICE

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Shipping Method

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Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

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