MT29F64G08CBEDBJ4-12:D TR

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Mfr.Part #
MT29F64G08CBEDBJ4-12:D TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 64GBIT PARALLEL 132VBGA
Stock
12,823
In Stock :
12,823

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Manufacturer :
Micron Technology
Product Category :
Memory
RoHS Status :
ROHS3 Compliant
Memory Format :
Flash
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Supplier Device Package :
132-VBGA (12x18)
Clock Frequency :
83MHz
Operating Temperature :
0°C~70°C TA
Packaging :
Tape and Reel (TR)
Voltage - Supply :
2.7V~3.6V
Memory Type :
Non-Volatile
Memory Size :
64Gb 8G x 8
Package / Case :
132-VBGA
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT29F64G08CBEDBJ4-12:D TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29F64G08CBEDBJ4-12:D TR pinout, MT29F64G08CBEDBJ4-12:D TR datasheet PDF, MT29F64G08CBEDBJ4-12:D TR amp .Beyond Memory Micron Technology MT29F64G08CBEDBJ4-12:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F64G08CBEDBJ4-12:D TR


Memory Micron Technology MT29F64G08CBEDBJ4-12:D TR Overview

The Memory Micron Technology MT29F64G08CBEDBJ4-12:D TR represents a breakthrough in flash memory technology, offering unparalleled storage capacity and durability for industrial and commercial applications. Manufactured by Micron Technology, this integrated circuit features a 64Gbit density with a parallel interface, encapsulated in a compact 132-ball grid array (VBGA) package. Ideal for environments where space and reliability are crucial, this product enhances system efficiency with its advanced design, making it an optimal solution for large-scale deployments in a variety of demanding applications.

MT29F64G08CBEDBJ4-12:D TR Features

This IC flash memory module boasts numerous technical features that cater to robust, high-performance applications. It supports a parallel interface that ensures high-speed data transfer rates, making it suitable for performance-intensive operations. The 132VBGA packaging is not only space-efficient but also offers improved thermal stability and reduced power consumption, crucial for continuous, reliable operation.

MT29F64G08CBEDBJ4-12:D TR Applications

  • Mobile Devices: Employed in smartphones and tablets to provide high-density, reliable memory for operating systems, applications, and user data storage.
  • Embedded Systems: Integral for use in industrial automation systems and IoT devices, where its robustness ensures longevity and consistent performance under challenging conditions.
  • Enterprise Solutions: Ideal for data centers and server farms, facilitating efficient data management and storage solutions that require extensive read/write cycles without compromising data integrity.
  • Consumer Electronics: Used in digital cameras, gaming consoles, and other personal electronics, where its large storage capacity and fast processing are essential for enhancing user experience.
  • Automotive Applications: Suitable for in-vehicle systems such as infotainment and advanced driver assistance systems (ADAS), which demand high reliability and endurance in harsh environments.
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