MT29F512G08EEHAFJ4-3RES:A TR

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Mfr.Part #
MT29F512G08EEHAFJ4-3RES:A TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 512GBIT PAR 132VBGA
Stock
8,392
In Stock :
8,392

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
2.5V~3.6V
Memory Format :
Flash
Factory Lead Time :
12 Weeks
Packaging :
Tape and Reel (TR)
Operating Temperature :
0°C~70°C TA
Memory Size :
512Gb 64G x 8
Memory Interface :
Parallel
Package / Case :
132-VBGA
Memory Type :
Non-Volatile
Clock Frequency :
333MHz
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT29F512G08EEHAFJ4-3RES:A TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29F512G08EEHAFJ4-3RES:A TR pinout, MT29F512G08EEHAFJ4-3RES:A TR datasheet PDF, MT29F512G08EEHAFJ4-3RES:A TR amp .Beyond Memory Micron Technology MT29F512G08EEHAFJ4-3RES:A TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F512G08EEHAFJ4-3RES:A TR


Memory Micron Technology MT29F512G08EEHAFJ4-3RES:A TR Overview

Introducing the Memory Micron Technology MT29F512G08EEHAFJ4-3RES:A TR, a high-capacity, robust flash memory IC that embodies the forefront of memory technology by Micron Technology. This product is designed to cater to the demanding requirements of modern storage solutions, offering a substantial 512 Gbit storage capacity in a compact 132-ball VFBGA package. Its exceptional reliability and performance make it ideal for applications requiring extensive data storage and rapid access speeds. The integration of advanced memory technology allows for improved data integrity and efficiency, making this flash memory an essential component for developers and manufacturers aiming to enhance their systems with top-tier memory solutions.

MT29F512G08EEHAFJ4-3RES:A TR Features

This IC FLASH device boasts a range of features designed to provide a reliable, high-performance storage solution. With its vast 512 Gbit storage capacity and parallel interface, it facilitates swift data management and retrieval. The 132-ball VFBGA packaging ensures a minimal footprint on the system board, while providing robustness and durability in a wide range of environmental conditions. This makes the MT29F512G08EEHAFJ4-3RES:A TR an ideal choice for sophisticated electronics that require high-density, high-reliability memory storage.

MT29F512G08EEHAFJ4-3RES:A TR Applications

  • Enterprise Storage Solutions: Ideal for data centers and enterprise storage systems, this IC can handle large-scale data storage needs, providing high-speed, reliable access to massive amounts of data.
  • Mobile Devices: Can be integrated into smartphones and tablets to increase internal storage capacity, enhancing device performance and user experience by allowing for more applications and multimedia storage.
  • Embedded Systems: Suitable for use in complex embedded systems, such as industrial controllers and IoT devices, where long-term reliability and high storage capacity are critical.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) and infotainment systems, offering the robustness and endurance needed in challenging automotive environments.
  • Consumer Electronics: Enhances the capabilities of consumer electronics, such as digital cameras and gaming consoles, by providing expanded storage for high-resolution images and game data.
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Shipping Cost

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