MT29F512G08EEHAFJ4-3R:A

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Mfr.Part #
MT29F512G08EEHAFJ4-3R:A
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 512GBIT PAR 132VBGA
Stock
5,406
In Stock :
5,406

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
132-VBGA
Factory Lead Time :
12 Weeks
Operating Temperature :
0°C~70°C TA
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
2.5V~3.6V
Mounting Type :
Surface Mount
Packaging :
Tray
Memory Type :
Non-Volatile
Clock Frequency :
333MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Memory Size :
512Gb 64G x 8
Memory Format :
Flash
Introducing Memory Micron Technology MT29F512G08EEHAFJ4-3R:A from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:132-VBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, MT29F512G08EEHAFJ4-3R:A pinout, MT29F512G08EEHAFJ4-3R:A datasheet PDF, MT29F512G08EEHAFJ4-3R:A amp .Beyond Memory Micron Technology MT29F512G08EEHAFJ4-3R:A ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F512G08EEHAFJ4-3R:A


Memory Micron Technology MT29F512G08EEHAFJ4-3R:A Overview

The Memory Micron Technology MT29F512G08EEHAFJ4-3R:A is a state-of-the-art integrated circuit from Micron Technology, specifically designed to meet the high-capacity storage demands of modern digital applications. This 512Gbit flash memory IC utilizes a parallel interface and is housed in a compact 132VBGA package, offering unparalleled density and performance for sophisticated electronic environments. Optimized for both efficiency and reliability, this memory component is essential for developers looking to harness large-scale storage solutions in a space-efficient form factor.

MT29F512G08EEHAFJ4-3R:A Features

This IC FLASH memory boasts a robust design with a storage capacity of 512 Gbit, ideal for intensive data management tasks. The use of a parallel interface ensures high-speed data transfer rates, which are critical in reducing system bottlenecks and improving overall device responsiveness. Additionally, the 132VBGA packaging not only minimizes the footprint but also enhances thermal management, making it an excellent choice for densely packed electronics that require reliable, long-term storage solutions.

MT29F512G08EEHAFJ4-3R:A Applications

  • Enterprise Servers and Data Centers: Ideal for handling large-scale databases and high-speed transactions, ensuring data integrity and quick access in critical business operations.
  • High-Performance Computing Systems: Supports complex computations and extensive data analysis, providing the necessary speed and capacity for scientific research and simulation processes.
  • Advanced Driver-Assistance Systems (ADAS): Can be integrated into automotive systems to process and store large amounts of data from sensors and cameras, crucial for real-time decision making and system updates.
  • Mobile Devices: Suitable for expanding the storage capabilities of smartphones and tablets, allowing them to manage and store higher-resolution media and larger application files efficiently.
  • Video Surveillance Systems: Provides the high-capacity, reliable storage necessary for recording and retaining extensive video footage, essential in security and monitoring applications.
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Shipping Cost

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