MT29F512G08EECAGJ4-5M:A TR

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Mfr.Part #
MT29F512G08EECAGJ4-5M:A TR
Manufacturer
Micron Technology
Package / Case
Datasheet
Download
Description
TLC 512G 64GX8 VBGA DDP
Stock
7,698
In Stock :
7,698

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Manufacturer :
Micron Technology
Product Category :
Memory
Factory Lead Time :
5 Weeks
Packaging :
Tape and Reel (TR)
Introducing Memory Micron Technology MT29F512G08EECAGJ4-5M:A TR from Chip IC,where excellence meets affordability. This product stands out with its MT29F512G08EECAGJ4-5M:A TR pinout, MT29F512G08EECAGJ4-5M:A TR datasheet PDF, MT29F512G08EECAGJ4-5M:A TR amp .Beyond Memory Micron Technology MT29F512G08EECAGJ4-5M:A TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F512G08EECAGJ4-5M:A TR


Memory Micron Technology MT29F512G08EECAGJ4-5M:A TR Overview

Introducing the Memory Micron Technology MT29F512G08EECAGJ4-5M:A TR, a high-performance Triple-Level Cell (TLC) NAND flash memory. This product is designed to meet the rigorous demands of modern storage systems, offering a substantial 512G capacity with a 64Gx8 configuration. Encased in a VBGA DDP package, it is tailored for applications requiring high density, endurance, and performance. Its reliability and advanced technology make it an ideal choice for developers and manufacturers aiming to enhance their storage solutions.

MT29F512G08EECAGJ4-5M:A TR Features

The MT29F512G08EECAGJ4-5M:A TR memory module boasts advanced features that set it apart in the market. Key attributes include its triple-level cell NAND structure, providing a balance of cost, performance, and durability. Additionally, the VBGA (Very thin Ball Grid Array) package ensures a compact footprint and robust physical protection, making it suitable for high-density applications. The dual die package (DDP) configuration enhances its operational efficiency, providing higher throughput and reduced latency.

MT29F512G08EECAGJ4-5M:A TR Applications

  • Enterprise Storage Solutions: Ideal for use in data centers and large-scale storage systems where density and reliability are critical. The high capacity and endurance of this memory module ensure sustained performance under heavy workloads.
  • High-End Personal Computing: Enhances the storage capabilities of high-performance personal computers, especially for gaming, professional graphics design, and video editing, where speed and large storage capacity are necessary.
  • Industrial Applications: Well-suited for deployment in harsh environments where reliability and endurance are paramount. Its robust packaging protects against physical and environmental stresses.
  • Embedded Systems: Can be integrated into embedded systems within automotive or smart devices, supporting advanced functionalities and immediate data access.
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