MT29F32G08CBECBL73A3WC1

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Mfr.Part #
MT29F32G08CBECBL73A3WC1
Manufacturer
Micron Technology
Package / Case
Die
Datasheet
Download
Description
IC FLASH 32GBIT PARALLEL DIE
Stock
43,730
In Stock :
43,730

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Bulk
Voltage - Supply :
2.7V~3.6V
Package / Case :
Die
Memory Type :
Non-Volatile
Memory Format :
Flash
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Memory Size :
32Gb 4G x 8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2012
RoHS Status :
ROHS3 Compliant
Introducing Memory Micron Technology MT29F32G08CBECBL73A3WC1 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Die, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, MT29F32G08CBECBL73A3WC1 pinout, MT29F32G08CBECBL73A3WC1 datasheet PDF, MT29F32G08CBECBL73A3WC1 amp .Beyond Memory Micron Technology MT29F32G08CBECBL73A3WC1 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.



Memory IC

MT29F32G08CBECBL73A3WC1 Overview


Its memory type can be classified as Non-Volatile. It is supplied votage within Bulk. It is available in Die case. The memory size of the chip is 32Gb 4G x 8 Mb. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of 0°C~70°C TA, this device is capable of lots of demanding applications. It is supplied votage within 2.7V~3.6V. Its recommended mounting type is Surface Mount.

MT29F32G08CBECBL73A3WC1 Features


Package / Case: Die


MT29F32G08CBECBL73A3WC1 Applications


There are a lot of Micron Technology Inc.
MT29F32G08CBECBL73A3WC1 Memory applications.


  • Cache memory
  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
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