MT29F32G08CBADAL83A3WC1
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- Mfr.Part #
- MT29F32G08CBADAL83A3WC1
- Manufacturer
- Micron Technology
- Package / Case
- Die
- Datasheet
- Download
- Description
- IC FLASH 32GBIT PARALLEL DIE
- Stock
- 10,350
- In Stock ：
- 10,350
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Interface :
- Parallel
- Packaging :
- Tray
- Memory Type :
- Non-Volatile
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 2.7V~3.6V
- Max Operating Temperature :
- 70°C
- Factory Lead Time :
- 3 Weeks
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Memory Format :
- Flash
- Min Operating Temperature :
- 0°C
- Memory Size :
- 32Gb 4G x 8
- Memory Interface :
- Parallel
- Operating Temperature :
- 0°C~70°C TA
- Supplier Device Package :
- Die
- Package / Case :
- Die
- Datasheets
- MT29F32G08CBADAL83A3WC1
Memory IC
MT29F32G08CBADAL83A3WC1 Overview
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Tray size. The case is embedded in Die. Memory size on the chip is 32Gb 4G x 8. This device uses takes advantage of the FLASH format. The device's extended operating temperature range of 0°C~70°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. The recommended mounting type for this device is Surface Mount. A minimum operating temperature of 0°C is required for this device. It should not be operated above 70°C°C.
MT29F32G08CBADAL83A3WC1 Features
Package / Case: Die
MT29F32G08CBADAL83A3WC1 Applications
There are a lot of Micron Technology Inc.
MT29F32G08CBADAL83A3WC1 Memory applications.
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
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