MT29F32G08AFACAWP-IT:C

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Mfr.Part #
MT29F32G08AFACAWP-IT:C
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLSH 32GBIT PARALLEL 48TSOP I
Stock
5,530
In Stock :
5,530

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Manufacturer :
Micron Technology
Product Category :
Memory
Supply Voltage :
3.3V
Base Part Number :
MT29F32G08
Data Polling :
No
Access Time (Max) :
20 ns
Organization :
4GX8
Terminal Position :
Dual
Supply Voltage-Max (Vsup) :
3.6V
Sector Size :
512k
Memory Interface :
Parallel
Voltage - Supply :
2.7V~3.6V
Radiation Hardening :
No
Memory Size :
32Gb 4G x 8
Ready/Busy :
yes
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Height Seated (Max) :
1.2mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2010
Supply Voltage-Min (Vsup) :
2.7V
Packaging :
Tray
Memory Type :
Non-Volatile
Sync/Async :
ASYNCHRONOUS
Number of Terminations :
48
Page Size :
4Kwords
Programming Voltage :
2.7V
Command User Interface :
yes
Density :
32 GB
Address Bus Width :
1b
Mount :
Surface Mount
RoHS Status :
ROHS3 Compliant
Length :
18.4mm
Toggle Bit :
No
Number of Sectors/Size :
8k
Operating Temperature :
-40°C~85°C TA
Nominal Supply Current :
50mA
Memory Width :
8
Word Size :
8B
Memory Format :
Flash
Mounting Type :
Surface Mount
Operating Supply Voltage :
3.3V
Number of Pins :
48
Terminal Pitch :
0.5mm
Number of Functions :
1
Introducing Memory Micron Technology MT29F32G08AFACAWP-IT:C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:MT29F32G08, Package / Case:48-TFSOP (0.724, 18.40mm Width), Number of Terminations:48, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Pins:48, MT29F32G08AFACAWP-IT:C pinout, MT29F32G08AFACAWP-IT:C datasheet PDF, MT29F32G08AFACAWP-IT:C amp .Beyond Memory Micron Technology MT29F32G08AFACAWP-IT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F32G08AFACAWP-IT:C


Memory Micron Technology MT29F32G08AFACAWP-IT:C Overview

Introducing the Micron Technology MT29F32G08AFACAWP-IT:C, a robust 32Gbit NAND flash memory component housed in a compact 48-pin TSOP package. This high-capacity storage solution is designed to meet the demanding requirements of a broad spectrum of applications, delivering both high performance and reliability. The Memory Micron Technology MT29F32G08AFACAWP-IT:C ensures efficient data management and storage capabilities, ideal for manufacturers looking to enhance their systems with fast and durable memory components. Its impressive storage capacity and durability make it a pivotal choice for businesses aiming to leverage advanced memory technology for industrial-grade applications.

MT29F32G08AFACAWP-IT:C Features

The MT29F32G08AFACAWP-IT:C from Micron Technology is engineered for efficiency and performance. Features include a parallel interface for rapid data transfer rates and a 32Gbit capacity for substantial data storage. The device operates with high endurance and reliability, which are crucial for intensive applications that require prolonged lifecycles. Its compact 48TSOP package ensures it can be integrated into various hardware configurations, maintaining a balance between performance and physical size.

MT29F32G08AFACAWP-IT:C Applications

  • Consumer Electronics: Used in smartphones and tablets to store user data and run applications efficiently, ensuring quick access to stored information and a smooth user experience.
  • Enterprise Storage: Ideal for data center applications, providing high-capacity and durable storage necessary for managing large volumes of data crucial for business operations.
  • Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to handle and store large amounts of data generated by vehicle sensors, contributing to enhanced functionality and safety.
  • Industrial Automation: Used in industrial control systems to log data and operate machinery, allowing for precise control and monitoring of industrial processes.
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