MT29F32G08ABEABM73A3WC1P
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- Mfr.Part #
- MT29F32G08ABEABM73A3WC1P
- Manufacturer
- Micron Technology
- Package / Case
- Die
- Datasheet
- Download
- Description
- IC FLASH 32GBIT PARALLEL DIE
- Stock
- 33,042
- In Stock ：
- 33,042
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Published :
- 2016
- Packaging :
- Bulk
- Voltage - Supply :
- 2.7V~3.6V
- Memory Interface :
- Parallel
- Operating Temperature :
- 0°C~70°C TA
- Memory Format :
- Flash
- Memory Type :
- Non-Volatile
- Package / Case :
- Die
- Supplier Device Package :
- Die
- Memory Size :
- 32Gb 4G x 8
- Max Operating Temperature :
- 70°C
- Min Operating Temperature :
- 0°C
- Interface :
- Parallel
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- MT29F32G08ABEABM73A3WC1P
Memory IC
MT29F32G08ABEABM73A3WC1P Overview
Non-Volatile is the type of memory it has. There is a Bulk case available. The Die case contains it. The chip has an 32Gb 4G x 8 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. This device must operate at a minimum temperature of 0°C. Temperatures no higher than 70°C degrees Celsius are recommended for operation.
MT29F32G08ABEABM73A3WC1P Features
Package / Case: Die
MT29F32G08ABEABM73A3WC1P Applications
There are a lot of Micron Technology Inc.
MT29F32G08ABEABM73A3WC1P Memory applications.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
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