MT29F32G08ABAAAM73A3WC1P
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- Mfr.Part #
- MT29F32G08ABAAAM73A3WC1P
- Manufacturer
- Micron Technology
- Package / Case
- Die
- Datasheet
- Download
- Description
- IC FLASH 32GBIT PARALLEL DIE
- Stock
- 14,171
- In Stock ：
- 14,171
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Memory Format :
- Flash
- RoHS Status :
- ROHS3 Compliant
- Min Operating Temperature :
- 0°C
- Supplier Device Package :
- Die
- Operating Temperature :
- 0°C~70°C TA
- Max Operating Temperature :
- 70°C
- Memory Interface :
- Parallel
- Memory Type :
- Non-Volatile
- Published :
- 2016
- Memory Size :
- 32Gb 4G x 8
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- Die
- Interface :
- Parallel
- Packaging :
- Bulk
- Voltage - Supply :
- 2.7V~3.6V
- Mounting Type :
- Surface Mount
- Datasheets
- MT29F32G08ABAAAM73A3WC1P
Memory IC
MT29F32G08ABAAAM73A3WC1P Overview
Its memory type can be classified as Non-Volatile. It comes in a Bulk. It is available in Die case. The memory size of the chip is 32Gb 4G x 8 Mb. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of 0°C~70°C TA, this device is capable of lots of demanding applications. It is supplied votage within 2.7V~3.6V. Its recommended mounting type is Surface Mount. The minimum operating temperature of this device must not be less than 0°C. It is recommended for operation at temperatures no higher than.
MT29F32G08ABAAAM73A3WC1P Features
Package / Case: Die
MT29F32G08ABAAAM73A3WC1P Applications
There are a lot of Micron Technology Inc.
MT29F32G08ABAAAM73A3WC1P Memory applications.
- Cache memory
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
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