MT29F2G16ABBEAHC:E
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- Mfr.Part #
- MT29F2G16ABBEAHC:E
- Manufacturer
- Micron Technology
- Package / Case
- 63-VFBGA
- Datasheet
- Download
- Description
- IC FLASH 2GBIT PARALLEL 63VFBGA
- Stock
- 20,860
- In Stock ：
- 20,860
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Contact Plating :
- Copper, Silver, Tin
- Number of Sectors/Size :
- 2k
- Radiation Hardening :
- No
- Terminal Position :
- BOTTOM
- Base Part Number :
- MT29F2G16
- Page Size :
- 1Kwords
- Number of Pins :
- 63
- Voltage - Supply :
- 1.7V~1.95V
- Packaging :
- Bulk
- Number of Terminations :
- 63
- Density :
- 2 GB
- Mount :
- Surface Mount
- Supply Voltage-Min (Vsup) :
- 1.7V
- Terminal Pitch :
- 0.8mm
- Memory Type :
- Non-Volatile
- Standby Current-Max :
- 0.00005A
- Height Seated (Max) :
- 1mm
- Supply Voltage :
- 1.8V
- Sector Size :
- 64K
- Nominal Supply Current :
- 20mA
- Data Polling :
- No
- Memory Format :
- Flash
- Factory Lead Time :
- 3 Weeks
- Access Time (Max) :
- 25 ns
- Package / Case :
- 63-VFBGA
- RoHS Status :
- ROHS3 Compliant
- Memory Interface :
- Parallel
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Address Bus Width :
- 28b
- Sync/Async :
- ASYNCHRONOUS
- Memory Size :
- 2Gb 128M x 16
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 1.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Width :
- 16
- Command User Interface :
- yes
- Ready/Busy :
- yes
- Word Size :
- 16b
- Published :
- 2012
- Pbfree Code :
- yes
- Length :
- 13mm
- Toggle Bit :
- No
- Number of Functions :
- 1
- Organization :
- 128MX16
- Supply Voltage-Max (Vsup) :
- 1.95V
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~70°C TA
- Datasheets
- MT29F2G16ABBEAHC:E
Memory Micron Technology MT29F2G16ABBEAHC:E Overview
Introducing the robust and high-capacity MT29F2G16ABBEAHC:E from Micron Technology, a leader in integrated circuit solutions. This NAND flash memory IC offers 2 Gbit of storage through a parallel interface, encased in a compact 63-ball VFBGA package. Designed to provide reliable, high-speed data retention for a myriad of advanced applications, this component is pivotal for developers looking to maximize storage density and performance under rigorous conditions. Its high reliability and efficiency make it an excellent choice for meeting the demanding specifications of contemporary electronic devices, thereby ensuring scalability and extended product lifecycles.
MT29F2G16ABBEAHC:E Features
The MT29F2G16ABBEAHC:E Flash IC is notable for its advanced 2 Gbit parallel interface, enabling rapid and efficient data handling capabilities. The device is encapsulated in a 63VFBGA package, ensuring minimal footprint on the PCB while providing robust protection for the internal circuitry. The high data transfer rates supported by this IC make it an optimal solution for applications requiring fast access and reliable data storage.
MT29F2G16ABBEAHC:E Applications
- Mobile Devices: Empowers smartphones and tablets with extended memory capacity, enhancing app performance and multitasking capabilities.
- Embedded Systems: Serves as a critical component in industrial and automotive applications, where long-term reliability and high-speed data access are paramount.
- Digital Cameras: Utilized in high-resolution digital cameras to improve the storage and processing speed of high-quality images.
- Portable Media Players: Increases the storage capabilities, allowing for more media content such as videos and music libraries.
- Gaming Devices: Enhances gaming consoles with faster load times and improved game data storage, leading to a better user experience.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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