MT29F256G08CECEBJ4-37ITR:E

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Mfr.Part #
MT29F256G08CECEBJ4-37ITR:E
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 256GBIT PAR 132VBGA
Stock
39,754
In Stock :
39,754

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Interface :
Parallel
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
Flash
Memory Type :
Non-Volatile
Clock Frequency :
267MHz
Operating Temperature :
-40°C~85°C TA
Voltage - Supply :
2.5V~3.6V
Package / Case :
132-VBGA
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Memory Size :
256Gb 32G x 8
Introducing Memory Micron Technology MT29F256G08CECEBJ4-37ITR:E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29F256G08CECEBJ4-37ITR:E pinout, MT29F256G08CECEBJ4-37ITR:E datasheet PDF, MT29F256G08CECEBJ4-37ITR:E amp .Beyond Memory Micron Technology MT29F256G08CECEBJ4-37ITR:E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F256G08CECEBJ4-37ITR:E


Memory Micron Technology MT29F256G08CECEBJ4-37ITR:E Overview

The Memory Micron Technology MT29F256G08CECEBJ4-37ITR:E is a high-capacity, 256 Gbit NAND flash memory device optimized for robust data storage solutions. Manufactured by Micron Technology, this integrated circuit is packaged in a compact 132-ball VFBGA form factor. It provides high-speed parallel interface capabilities and is specifically designed to meet the demanding requirements of both industrial and consumer electronics markets. This product is an excellent choice for developers and manufacturers looking to incorporate reliable flash storage into their applications, with a focus on enhancing performance and extending product life cycles.

MT29F256G08CECEBJ4-37ITR:E Features

This IC FLASH from Micron Technology features a 256 Gbit storage capacity and a parallel interface for high-speed data transfer. It is encased in a 132-ball VFBGA package that ensures a minimal footprint on system boards, thus providing greater design flexibility. The device supports a wide range of temperature and operational conditions, making it suitable for rigorous environments.

MT29F256G08CECEBJ4-37ITR:E Applications

  • Enterprise Storage Solutions: Utilized in data centers and enterprise storage systems to manage large volumes of data efficiently.
  • Mobile Devices: Integral for expanding storage capabilities in smartphones and tablets without compromising on system speed and responsiveness.
  • Automotive Applications: Used in advanced driver-assistance systems (ADAS) to store firmware and data logs that help improve vehicle safety and functionality.
  • Industrial Automation: Enhances the reliability and storage capacity of machines and control systems in industrial settings.
  • Consumer Electronics: Ideal for use in digital cameras, gaming consoles, and other consumer electronics that require high-density, reliable storage.
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Shipping Cost

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