MT29F1T208ECHBBJ4-3R:B

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Mfr.Part #
MT29F1T208ECHBBJ4-3R:B
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.125T PARALLEL 132VBGA
Stock
11,329
In Stock :
11,329

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
1.125Tb 144G x 8
Voltage - Supply :
2.5V~3.6V
Operating Temperature :
0°C~70°C TA
Packaging :
Tray
Package / Case :
132-VBGA
Memory Interface :
Parallel
Clock Frequency :
333MHz
Memory Type :
Non-Volatile
Mounting Type :
Surface Mount
Memory Format :
Flash
Introducing Memory Micron Technology MT29F1T208ECHBBJ4-3R:B from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29F1T208ECHBBJ4-3R:B pinout, MT29F1T208ECHBBJ4-3R:B datasheet PDF, MT29F1T208ECHBBJ4-3R:B amp .Beyond Memory Micron Technology MT29F1T208ECHBBJ4-3R:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1T208ECHBBJ4-3R:B


Memory Micron Technology MT29F1T208ECHBBJ4-3R:B Overview

The Memory Micron Technology MT29F1T208ECHBBJ4-3R:B represents a cutting-edge solution in high-density flash memory technology, tailored for applications requiring robust, high-capacity data storage. Manufactured by Micron Technology, this IC FLASH 1.125T PARALLEL 132VBGA delivers superior reliability and performance in a compact 132-pin V-BGA package. Designed to meet the rigorous demands of both industrial and commercial environments, this product ensures optimal functionality and durability under a variety of operating conditions.

MT29F1T208ECHBBJ4-3R:B Features

This high-capacity flash memory chip offers 1.125 terabits of storage, providing ample space for large-scale applications. Its parallel interface ensures fast data transfer rates, making it an ideal choice for systems that require rapid access to large volumes of data. The compact 132VBGA package is engineered for efficient space utilization on printed circuit boards, enhancing system design flexibility.

MT29F1T208ECHBBJ4-3R:B Applications

  • Enterprise Storage Systems: Utilized in data centers and enterprise storage systems, this memory chip supports high-volume data management and storage redundancy, ensuring reliable, fast access to critical information.
  • High-Performance Computing: Integral to high-performance computing applications, where speed and data integrity are paramount. This chip aids in processing complex computations and large datasets efficiently.
  • Automotive Systems: Employed in advanced automotive systems, including infotainment and advanced driver-assistance systems (ADAS), providing the robust, high-speed memory necessary for real-time processing.
  • Industrial Automation: Suitable for industrial automation systems, where durability and the ability to handle large-scale operational data are crucial. Enhances performance and reliability in harsh industrial environments.
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