MT29F1T208ECCBBJ4-37:B

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Mfr.Part #
MT29F1T208ECCBBJ4-37:B
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.125T PAR 132VBGA
Stock
15,940
In Stock :
15,940

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
2.7V~3.6V
Memory Interface :
Parallel
Package / Case :
132-VBGA
Clock Frequency :
267MHz
Packaging :
Tray
Memory Format :
Flash
Mounting Type :
Surface Mount
Memory Type :
Non-Volatile
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Memory Size :
1.125Tb 144G x 8
Operating Temperature :
0°C~70°C TA
Introducing Memory Micron Technology MT29F1T208ECCBBJ4-37:B from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:132-VBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, MT29F1T208ECCBBJ4-37:B pinout, MT29F1T208ECCBBJ4-37:B datasheet PDF, MT29F1T208ECCBBJ4-37:B amp .Beyond Memory Micron Technology MT29F1T208ECCBBJ4-37:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1T208ECCBBJ4-37:B


Memory Micron Technology MT29F1T208ECCBBJ4-37:B Overview

The Memory Micron Technology MT29F1T208ECCBBJ4-37:B is a high-performance Integrated Circuit (IC) FLASH memory component designed to meet the demanding needs of modern electronics. With a robust 1.125 terabit capacity encapsulated in a compact 132-lead VBGA package, this FLASH memory IC offers an exceptional blend of density, reliability, and performance. It is specifically engineered to handle extensive data storage requirements while maintaining high-speed access, making it an ideal choice for advanced digital storage solutions that require longevity and efficiency. The application of Memory Micron Technology MT29F1T208ECCBBJ4-37:B in bulk purchasing scenarios underscores its capacity to support large-scale operations, ensuring manufacturers and technology developers have a reliable, high-quality memory resource at their disposal.

MT29F1T208ECCBBJ4-37:B Features

This IC FLASH memory component boasts several key features including a parallel interface for fast data transfer, low power consumption for enhanced energy efficiency, and a wide temperature range operation suitable for demanding environments. The integration of advanced wear-leveling and error correction technologies further boosts its reliability and durability, ensuring data integrity and extending product life in rigorous applications.

MT29F1T208ECCBBJ4-37:B Applications

  • Enterprise Storage Solutions: Applied in data centers and enterprise storage systems, the MT29F1T208ECCBBJ4-37:B provides robust data integrity and high storage density essential for managing large volumes of data efficiently.
  • Embedded Systems: Ideal for use in embedded applications where space and power efficiency are critical. This IC enables high-capacity memory solutions within compact device frameworks.
  • Consumer Electronics: Utilized in consumer electronics such as advanced cameras and gaming devices, offering extensive data storage capabilities that enhance user experience and device functionality.
  • Automotive Electronics: Supports the sophisticated requirements of automotive systems, including navigation and infotainment systems, by providing durable, high-capacity memory under harsh environmental conditions.
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