MT29F1T08EEHAFJ4-3TES:A TR

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Mfr.Part #
MT29F1T08EEHAFJ4-3TES:A TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1TB PARALLEL 132VBGA
Stock
8,212
In Stock :
8,212

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Interface :
Parallel
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
2.5V~3.6V
Factory Lead Time :
12 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tape and Reel (TR)
Memory Format :
Flash
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Memory Type :
Non-Volatile
Memory Size :
1Tb 128G x 8
Package / Case :
132-VBGA
Clock Frequency :
333MHz
Introducing Memory Micron Technology MT29F1T08EEHAFJ4-3TES:A TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:132-VBGA, MT29F1T08EEHAFJ4-3TES:A TR pinout, MT29F1T08EEHAFJ4-3TES:A TR datasheet PDF, MT29F1T08EEHAFJ4-3TES:A TR amp .Beyond Memory Micron Technology MT29F1T08EEHAFJ4-3TES:A TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1T08EEHAFJ4-3TES:A TR


Memory Micron Technology MT29F1T08EEHAFJ4-3TES:A TR Overview

Introducing the Micron Technology MT29F1T08EEHAFJ4-3TES:A TR, a high-capacity 1TB parallel NAND flash memory IC encapsulated in a 132VBGA package. This product stands out in the Memory sector for its robust storage solutions tailored for applications requiring high volume, endurance, and reliability. The MT29F1T08EEHAFJ4-3TES:A TR offers a seamless integration for developers, thanks to Micron's advanced manufacturing technology that ensures superior performance, longevity, and lower power consumption. Perfect for businesses looking to scale operations, this memory component exemplifies top-tier storage solutions.

MT29F1T08EEHAFJ4-3TES:A TR Features

The MT29F1T08EEHAFJ4-3TES:A TR flash memory IC offers remarkable features designed for demanding applications. Key features include its 1TB of high-density storage, the utilization of advanced NAND technology, and the compact 132VBGA package that ensures a minimal footprint while providing maximum storage capability. Additionally, this model is optimized for parallel interface to enhance data throughput and efficiency, making it ideal for next-generation storage systems.

MT29F1T08EEHAFJ4-3TES:A TR Applications

  • Enterprise Storage Solutions: Utilized in data centers and enterprise SSDs, this IC helps manage large volumes of data efficiently, ensuring quick access and robust data integrity.
  • Embedded Systems: Perfect for use in embedded applications where large storage and high reliability are necessary, such as automotive infotainment systems and industrial automation.
  • Consumer Electronics: Enhances the performance and storage capacity of consumer electronic products like high-end cameras, tablets, and smart TVs.
  • Telecommunications: Critical in telecom equipment, where massive storage and speedy data access are required to handle and store vast amounts of data generated by network traffic.
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