MT29F1T08CMHBBJ4-3RES:B TR

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Mfr.Part #
MT29F1T08CMHBBJ4-3RES:B TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1TB PARALLEL 132VBGA
Stock
41,663
In Stock :
41,663

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Type :
Non-Volatile
Clock Frequency :
333MHz
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Factory Lead Time :
12 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
Flash
Memory Size :
1Tb 128G x 8
Packaging :
Tape and Reel (TR)
Voltage - Supply :
2.5V~3.6V
RoHS Status :
ROHS3 Compliant
Package / Case :
132-VBGA
Introducing Memory Micron Technology MT29F1T08CMHBBJ4-3RES:B TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, MT29F1T08CMHBBJ4-3RES:B TR pinout, MT29F1T08CMHBBJ4-3RES:B TR datasheet PDF, MT29F1T08CMHBBJ4-3RES:B TR amp .Beyond Memory Micron Technology MT29F1T08CMHBBJ4-3RES:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1T08CMHBBJ4-3RES:B TR


Memory Micron Technology MT29F1T08CMHBBJ4-3RES:B TR Overview

The Memory Micron Technology MT29F1T08CMHBBJ4-3RES:B TR is a high-capacity, 1TB flash memory chip, engineered by Micron Technology, one of the leaders in memory and storage solutions. This IC FLASH utilizes a parallel interface and is housed in a compact 132-pin VBG (Very BGA) package, making it ideal for high-density applications where space and power efficiency are critical. This product is crafted to support the rigorous demands of extensive data processing and storage, providing robust, reliable performance essential for modern technology deployments.

MT29F1T08CMHBBJ4-3RES:B TR Features

This flash memory chip boasts several distinctive features:

  • High Capacity: 1 Terabyte of storage allows for extensive data handling and storage capabilities.
  • Parallel Interface: Facilitates faster data transfer speeds and efficient interfacing with host devices.
  • Compact Design: 132VBGA package ensures minimal footprint on system boards, ideal for compact systems.
  • Durability: Built to withstand industrial applications and demanding environments.

MT29F1T08CMHBBJ4-3RES:B TR Applications

  • Enterprise Storage Systems: Ideal for data centers requiring large-scale, high-speed storage solutions, where it delivers exceptional performance and reliability.
  • High-Performance Computing: Suitable for complex computations needing swift data access and storage resilience.
  • Mobile Computing: Its compact size and high storage capacity make it perfect for advanced mobile devices requiring significant memory without compromising on space.
  • Embedded Systems: Used in sophisticated embedded systems, providing ample storage and efficient processing in tight spaces and demanding conditions.
  • Automotive Applications: Can be integrated into advanced driver-assistance systems (ADAS) where robust data processing and storage are crucial.
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