MT29F1HT08EMHBBJ4-3R:B

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Mfr.Part #
MT29F1HT08EMHBBJ4-3R:B
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.5T PARALLEL 132VBGA
Stock
16,243
In Stock :
16,243

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
132-VBGA
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~70°C TA
Clock Frequency :
333MHz
Memory Size :
1.5Tb 192G x 8
Mounting Type :
Surface Mount
Memory Type :
Non-Volatile
Memory Format :
Flash
Voltage - Supply :
2.5V~3.6V
Memory Interface :
Parallel
Packaging :
Tray
Introducing Memory Micron Technology MT29F1HT08EMHBBJ4-3R:B from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:132-VBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, MT29F1HT08EMHBBJ4-3R:B pinout, MT29F1HT08EMHBBJ4-3R:B datasheet PDF, MT29F1HT08EMHBBJ4-3R:B amp .Beyond Memory Micron Technology MT29F1HT08EMHBBJ4-3R:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1HT08EMHBBJ4-3R:B


Memory Micron Technology MT29F1HT08EMHBBJ4-3R:B Overview

The Memory Micron Technology MT29F1HT08EMHBBJ4-3R:B is a state-of-the-art IC FLASH 1.5T device encapsulated in a compact 132VBGA package. Designed by Micron Technology, a leader in memory and storage solutions, this product offers high-density, high-performance flash memory solutions that meet the evolving demands of modern technology applications. With its large 1.5 Terabit capacity and parallel interface, this IC is optimized for applications requiring fast access and reliable storage of large amounts of data, making it ideal for advanced industrial, computing, and consumer electronics markets. The robust design ensures sustained performance and reliability even in rigorous environments, thereby appealing to B2B customers looking to integrate cutting-edge memory technology into their products.

MT29F1HT08EMHBBJ4-3R:B Features

This integrated circuit is equipped with several features that make it a highly competitive choice in the market:

  • 1.5 Terabit capacity: Provides ample storage for complex applications and data-intensive processes.
  • Parallel interface: Ensures fast data transfer rates, enhancing the overall system performance.
  • 132VBGA packaging: Offers a compact footprint suitable for space-constrained applications.
  • High durability: Built to withstand harsh operational conditions, ensuring long-term reliability.

MT29F1HT08EMHBBJ4-3R:B Applications

  • Enterprise Storage Solutions: Utilized in data centers and enterprise storage systems, where high capacity and reliability are crucial for managing large volumes of data efficiently.
  • Advanced Consumer Electronics: Integrated into high-end consumer electronics such as gaming consoles and smart TVs, enhancing their performance with robust, high-speed storage capabilities.
  • Industrial Automation: Employs in industrial automation systems to handle and store vast amounts of data generated by complex machinery and sensors.
  • Automotive Systems: Critical in advanced automotive applications, including infotainment and driver assist systems, where durable, high-capacity memory is needed.
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Shipping Cost

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