MT29F1HT08EMCBBJ4-37:B TR

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Mfr.Part #
MT29F1HT08EMCBBJ4-37:B TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.5T PARALLEL 132VBGA
Stock
15,335
In Stock :
15,335

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Interface :
Parallel
Packaging :
Tape and Reel (TR)
Operating Temperature :
0°C~70°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
2.7V~3.6V
Clock Frequency :
267MHz
Package / Case :
132-VBGA
RoHS Status :
ROHS3 Compliant
Memory Size :
1.5Tb 192G x 8
Memory Type :
Non-Volatile
Memory Format :
Flash
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT29F1HT08EMCBBJ4-37:B TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29F1HT08EMCBBJ4-37:B TR pinout, MT29F1HT08EMCBBJ4-37:B TR datasheet PDF, MT29F1HT08EMCBBJ4-37:B TR amp .Beyond Memory Micron Technology MT29F1HT08EMCBBJ4-37:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1HT08EMCBBJ4-37:B TR


Memory Micron Technology MT29F1HT08EMCBBJ4-37:B TR Overview

The Memory Micron Technology MT29F1HT08EMCBBJ4-37:B TR is an advanced flash memory device that offers 1.5 Terabits of storage in a compact 132-ball VFBGA (Very Fine Ball Grid Array) package. Designed by Micron Technology, a leader in memory and storage solutions, this integrated circuit (IC) provides high-density, parallel interface flash memory. It is ideal for applications requiring large amounts of data storage with reliable access and performance. The product’s robust design ensures it can meet the demanding requirements of industrial applications, providing longevity and endurance where it matters most.

MT29F1HT08EMCBBJ4-37:B TR Features

This flash memory IC boasts several key features that make it an attractive choice for technology integrators and manufacturers:

  • High storage capacity of 1.5 Terabits, allowing extensive data handling and storage.
  • Parallel interface for rapid data access and high throughput.
  • Compact 132VBGA package, which minimizes space on the PCB while providing robust data storage.
  • Durability and reliability synonymous with Micron Technology’s manufacturing standards.

MT29F1HT08EMCBBJ4-37:B TR Applications

  • Enterprise Storage Systems: Utilized in data centers and enterprise storage solutions, this IC enhances data throughput and storage capacity, optimizing server efficiency and reliability.
  • Industrial Automation: Plays a crucial role in the complex data logging and machinery control systems required in modern industrial environments.
  • Telecommunications Equipment: Critical for managing and storing large volumes of data in telecommunications infrastructure, supporting high-speed data transmission and network reliability.
  • Automotive Electronics: Suitable for use in advanced driver-assistance systems (ADAS) and other in-vehicle networks that require high data integrity and storage capacity.
  • Consumer Electronics: Applied in high-end consumer electronics like advanced digital cameras and video recorders, where large-scale data storage is essential for high-resolution media capturing and processing.
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Shipping Method

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Shipping Cost

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