MT29F1HT08EMCBBJ4-37:B

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Mfr.Part #
MT29F1HT08EMCBBJ4-37:B
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.5T PARALLEL 132VBGA
Stock
37,702
In Stock :
37,702

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Manufacturer :
Micron Technology
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Voltage - Supply :
2.7V~3.6V
Memory Type :
Non-Volatile
Memory Format :
Flash
Clock Frequency :
267MHz
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Package / Case :
132-VBGA
Packaging :
Tray
Memory Size :
1.5Tb 192G x 8
Operating Temperature :
0°C~70°C TA
Introducing Memory Micron Technology MT29F1HT08EMCBBJ4-37:B from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:132-VBGA, Operating Temperature:0°C~70°C TA, MT29F1HT08EMCBBJ4-37:B pinout, MT29F1HT08EMCBBJ4-37:B datasheet PDF, MT29F1HT08EMCBBJ4-37:B amp .Beyond Memory Micron Technology MT29F1HT08EMCBBJ4-37:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1HT08EMCBBJ4-37:B


Memory Micron Technology MT29F1HT08EMCBBJ4-37:B Overview

The Memory Micron Technology MT29F1HT08EMCBBJ4-37:B IC FLASH 1.5T PARALLEL 132VBGA represents a robust flash memory solution designed by Micron Technology, one of the leading innovators in memory and storage solutions. This high-density integrated circuit provides a massive 1.5 Terabits of parallel flash memory, encapsulated in a compact 132-ball grid array (VBGA) package. Its high-capacity storage and fast data access capabilities make it ideal for applications that demand high-speed and reliable data storage and retrieval, enhancing both performance and efficiency in a variety of high-tech deployments.

MT29F1HT08EMCBBJ4-37:B Features

The MT29F1HT08EMCBBJ4-37:B offers several distinctive features that make it a top choice for developers and manufacturers. These include its vast storage capacity of 1.5 Terabits, high-speed parallel interface, and the reliability that comes with a BGA package, ensuring secure and durable connections in complex electronics. The device is specifically designed for high-throughput applications, providing robust performance under various environmental conditions.

MT29F1HT08EMCBBJ4-37:B Applications

  • Enterprise Storage Solutions: The high storage capacity and speed of this IC make it perfectly suited for use in enterprise-level storage systems, where large volumes of data need to be accessed quickly and reliably.
  • High-Performance Computing: Ideal for deployment in systems requiring high-speed data transfer and storage capabilities, such as computational research and data analysis platforms.
  • Consumer Electronics: Can be integrated into consumer electronics such as high-end cameras and gaming consoles, where large and fast memory is crucial for performance and user experience.
  • Automotive Systems: Suitable for use in advanced driver-assistance systems (ADAS) which require rapid processing of large sensor datasets to perform functions like real-time decision making.
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