MT29F1G08ABBDAHC:D TR

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Mfr.Part #
MT29F1G08ABBDAHC:D TR
Manufacturer
Micron Technology
Package / Case
63-VFBGA
Datasheet
Download
Description
IC FLASH 1GBIT PARALLEL 63VFBGA
Stock
10,476
In Stock :
10,476

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Manufacturer :
Micron Technology
Product Category :
Memory
Published :
2013
Memory Size :
1Gb 128M x 8
Memory Interface :
Parallel
Packaging :
Tape and Reel (TR)
Factory Lead Time :
3 Weeks
Operating Temperature :
0°C~70°C TA
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Memory Format :
Flash
Base Part Number :
MT29F1G08
Voltage - Supply :
1.7V~1.95V
Memory Type :
Non-Volatile
Package / Case :
63-VFBGA
Introducing Memory Micron Technology MT29F1G08ABBDAHC:D TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Base Part Number:MT29F1G08, Package / Case:63-VFBGA, MT29F1G08ABBDAHC:D TR pinout, MT29F1G08ABBDAHC:D TR datasheet PDF, MT29F1G08ABBDAHC:D TR amp .Beyond Memory Micron Technology MT29F1G08ABBDAHC:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29F1G08ABBDAHC:D TR


Memory Micron Technology MT29F1G08ABBDAHC:D TR Overview

The Memory Micron Technology MT29F1G08ABBDAHC:D TR is a high-performance 1Gbit NAND Flash memory component designed by Micron Technology, housed in a compact 63-VFBGA package. This flash memory device is engineered to deliver dependable storage solutions with robust data integrity features, tailored for applications requiring high density and reliability. Its parallel interface ensures high-speed data transfer rates, making it an ideal choice for a variety of demanding applications across different sectors. Its durability and efficiency make it particularly suitable for embedded solutions, where long-term reliability is paramount.

MT29F1G08ABBDAHC:D TR Features

  • High Capacity: 1Gbit of data storage enables substantial data handling capabilities.
  • Efficient Interface: Parallel interface facilitates high-speed data transfers essential for performance-critical applications.
  • Compact Form Factor: 63-VFBGA package allows for minimal footprint in system designs.
  • Durability: Designed for high endurance and long-term reliability, suitable for intensive operational environments.

MT29F1G08ABBDAHC:D TR Applications

  • Embedded Systems: Utilized in the core memory components of embedded systems, providing the necessary robustness and reliability for industrial automation and control devices.
  • Consumer Electronics: Serves as flash storage in consumer devices such as digital cameras and audio players, where high capacity and data integrity are crucial.
  • Automotive Applications: Employed in automotive infotainment systems, offering durable and consistent performance under harsh conditions.
  • Internet of Things (IoT) Devices: Supports IoT devices requiring high-volume data memory for efficient operation and connectivity.
  • Mobile Technology: Used in mobile technology where space and power efficiency are key, contributing to the development of lighter, more powerful devices.
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