MT29E1T208ECHBBJ4-3ES:B TR

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Mfr.Part #
MT29E1T208ECHBBJ4-3ES:B TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.125T PARALLEL 132VBGA
Stock
18,350
In Stock :
18,350

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Manufacturer :
Micron Technology
Product Category :
Memory
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Packaging :
Tape and Reel (TR)
Memory Type :
Non-Volatile
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
Flash
Voltage - Supply :
2.5V~3.6V
Factory Lead Time :
12 Weeks
RoHS Status :
ROHS3 Compliant
Memory Size :
1.125Tb 144G x 8
Package / Case :
132-VBGA
Introducing Memory Micron Technology MT29E1T208ECHBBJ4-3ES:B TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, MT29E1T208ECHBBJ4-3ES:B TR pinout, MT29E1T208ECHBBJ4-3ES:B TR datasheet PDF, MT29E1T208ECHBBJ4-3ES:B TR amp .Beyond Memory Micron Technology MT29E1T208ECHBBJ4-3ES:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29E1T208ECHBBJ4-3ES:B TR


Memory Micron Technology MT29E1T208ECHBBJ4-3ES:B TR Overview

The Memory Micron Technology MT29E1T208ECHBBJ4-3ES:B TR is an advanced flash memory IC, designed by Micron Technology to cater to high-performance and high-density storage requirements. This IC features a vast 1.125 terabits of parallel storage, housed within a compact 132-lead Very-thin Ball Grid Array (VBGA) package. Its robust design and high storage capacity make it ideal for applications demanding large-scale data storage and rapid access speeds. The integration of cutting-edge technology ensures reliability and efficiency, positioning this product as a top choice for B2B customers seeking volume procurement for sophisticated electronic systems.

MT29E1T208ECHBBJ4-3ES:B TR Features

The MT29E1T208ECHBBJ4-3ES:B TR flash IC offers several key features that make it standout in the semiconductor market. It utilizes parallel interface technology to ensure high-speed data transfer and quick access capabilities, making it highly suitable for performance-critical applications. Its compact 132VBGA package allows for efficient use of board space, which is crucial in modern electronic design. Furthermore, the high durability and extended operational life span underpin its suitability for industrial applications where longevity and reliability are paramount.

MT29E1T208ECHBBJ4-3ES:B TR Applications

  • Enterprise Storage Solutions: Utilized in data centers and enterprise storage systems, this IC enhances data processing capabilities and supports extensive data storage requirements.
  • High-Performance Computing: Suitable for supercomputers and high-performance servers, providing the necessary speed and capacity for intensive computational tasks.
  • Telecommunications Equipment: Used in networking hardware such as routers and switches to manage and store large volumes of data efficiently.
  • Automotive Electronics: Ideal for advanced driver-assistance systems (ADAS) and infotainment systems, where high data integrity and speed are crucial.
  • Industrial Automation: Plays a critical role in the storage and retrieval of operational data in automated production lines and control systems.
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