MT29E1T208ECHBBJ4-3:B

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Mfr.Part #
MT29E1T208ECHBBJ4-3:B
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.125T PARALLEL 132VBGA
Stock
17,225
In Stock :
17,225

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Type :
Non-Volatile
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Memory Size :
1.125Tb 144G x 8
Voltage - Supply :
2.5V~3.6V
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Package / Case :
132-VBGA
Memory Format :
Flash
Introducing Memory Micron Technology MT29E1T208ECHBBJ4-3:B from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:132-VBGA, MT29E1T208ECHBBJ4-3:B pinout, MT29E1T208ECHBBJ4-3:B datasheet PDF, MT29E1T208ECHBBJ4-3:B amp .Beyond Memory Micron Technology MT29E1T208ECHBBJ4-3:B ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29E1T208ECHBBJ4-3:B


Memory Micron Technology MT29E1T208ECHBBJ4-3:B Overview

The Memory Micron Technology MT29E1T208ECHBBJ4-3:B is a cutting-edge flash memory IC designed for high-capacity storage solutions. Manufactured by Micron Technology, this IC boasts a robust storage capacity of 1.125 terabytes within a 132-pin VBGA package, making it an ideal choice for applications requiring massive data retention without compromising on physical space. With its parallel interface, this memory component ensures high-speed data transfer and efficient performance tailored to meet the rigorous demands of modern technology systems.

MT29E1T208ECHBBJ4-3:B Features

This IC FLASH from Micron Technology features a parallel interface for rapid and reliable data handling. Encapsulated in a compact 132VBGA package, it offers a substantial 1.125 terabytes of storage, suitable for intensive applications. Its high endurance and durability make it perfect for sustained use in a variety of commercial and industrial environments.

MT29E1T208ECHBBJ4-3:B Applications

  • Enterprise Storage Systems: This IC can be integrated into server farms and data centers to provide high-density, reliable storage for managing large volumes of data efficiently.
  • Telecommunications Equipment: Utilized in telecommunications infrastructure to store vast amounts of information and support complex processes required for network management and data traffic control.
  • High-Performance Computing: Ideal for supercomputers and research facilities requiring quick access to large datasets and extensive memory for computational analysis and simulation tasks.
  • Industrial Applications: Fits seamlessly into industrial control systems where robust and durable memory storage is critical for process control and data logging under extreme conditions.
  • Consumer Electronics: Used in high-end consumer electronics such as gaming consoles and smart TVs, where large storage capacity and fast access speeds enhance user experience.
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