MT29E1HT08EMHBBJ4-3ES:B TR

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Mfr.Part #
MT29E1HT08EMHBBJ4-3ES:B TR
Manufacturer
Micron Technology
Package / Case
132-VBGA
Datasheet
Download
Description
IC FLASH 1.5T PARALLEL 132VBGA
Stock
39,704
In Stock :
39,704

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Manufacturer :
Micron Technology
Product Category :
Memory
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
2.5V~3.6V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~70°C TA
Memory Format :
Flash
Factory Lead Time :
12 Weeks
Packaging :
Tape and Reel (TR)
Memory Type :
Non-Volatile
Memory Interface :
Parallel
Package / Case :
132-VBGA
Memory Size :
1.5Tb 192G x 8
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT29E1HT08EMHBBJ4-3ES:B TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:132-VBGA, Mounting Type:Surface Mount, MT29E1HT08EMHBBJ4-3ES:B TR pinout, MT29E1HT08EMHBBJ4-3ES:B TR datasheet PDF, MT29E1HT08EMHBBJ4-3ES:B TR amp .Beyond Memory Micron Technology MT29E1HT08EMHBBJ4-3ES:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT29E1HT08EMHBBJ4-3ES:B TR


Memory Micron Technology MT29E1HT08EMHBBJ4-3ES:B TR Overview

Introducing the Memory Micron Technology MT29E1HT08EMHBBJ4-3ES:B TR, a state-of-the-art flash memory IC designed to cater to the high-performance requirements of modern technology applications. This 1.5 Terabit parallel flash memory device is housed in a 132VBGA package, offering robust reliability and superior speed, making it ideal for advanced industrial applications that demand high memory density and longevity. The strategic design and fabrication by Micron Technology ensure that this product delivers optimal performance while maintaining energy efficiency and cost-effectiveness, essential for bulk B2B procurement and deployment in various sectors.

MT29E1HT08EMHBBJ4-3ES:B TR Features

The MT29E1HT08EMHBBJ4-3ES:B TR offers several key features including a high-density 1.5T storage capacity and a parallel interface for swift data access and transfer. The compact 132VBGA package is specifically engineered to fit into space-constrained applications while providing ease of integration. Enhanced durability and a wide operational temperature range make it suitable for rigorous environments.

MT29E1HT08EMHBBJ4-3ES:B TR Applications

  • Data Centers: Utilized for bulk data storage solutions, facilitating fast access and reliability in server environments.
  • Enterprise Systems: Ideal for high-end computing systems where massive data processing and storage capacity are crucial.
  • Industrial Automation: Supports complex automation systems requiring high-speed, dependable memory for control processes.
  • Telecommunications Equipment: Enhances the performance and efficiency of telecommunications infrastructure by providing robust data retention capabilities.
  • Automotive Electronics: Can be integrated into advanced automotive systems, supporting navigation, infotainment, and driver assistance technologies.
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Shipping Cost

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