MSP430FR6970IRGCR

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Mfr.Part #
MSP430FR6970IRGCR
Manufacturer
Texas Instruments
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 32KB FRAM 64VQFN
Stock
24,120
In Stock :
24,120

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Core Processor :
CPUXV2
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
DAC Channels :
No
Terminal Form :
NO LEAD
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
Number of Pins :
64
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Size :
16-Bit
Data Converter :
A/D 8x12b
Number of UART Channels :
2
RAM Size :
2K x 8
Length :
9mm
Series :
MSP430™ FRAM
Peak Reflow Temperature (Cel) :
260
Lifecycle Status :
ACTIVE (Last Updated: 1 week ago)
PWM Channels :
yes
Interface :
I2C, IrDA, SCI, SPI, UART, USART
Package / Case :
64-VFQFN Exposed Pad
Number of I/O :
51
Memory Size :
32kB
Width :
9mm
Program Memory Type :
FRAM
Mounting Type :
Surface Mount
Surface Mount :
yes
Terminal Pitch :
0.5mm
Terminal Position :
QUAD
DMA Channels :
yes
Supply Voltage-Min (Vsup) :
1.8V
Frequency :
16MHz
Number of Terminations :
64
Program Memory Size :
32KB 32K x 8
Packaging :
Tape and Reel (TR)
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Base Part Number :
MSP430
Oscillator Type :
Internal
Pin Count :
64
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Thickness :
880μm
Lead Free :
Lead Free
Operating Temperature :
-40°C~85°C TA
Bit Size :
16
Factory Lead Time :
8 Weeks
Height :
1mm
Supply Voltage-Max (Vsup) :
3.6V
Has ADC :
yes
JESD-609 Code :
e4
Pbfree Code :
yes
Supply Voltage :
2.2V
Peripherals :
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Boundary Scan :
yes
Connectivity :
I2C, IrDA, SCI, SPI, UART/USART
Low Power Mode :
yes
Datasheets
MSP430FR6970IRGCR
Introducing Microcontrollers Texas Instruments MSP430FR6970IRGCR from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:64, Package / Case:64-VFQFN Exposed Pad, Mounting Type:Surface Mount, Number of Terminations:64, Base Part Number:MSP430, Operating Temperature:-40°C~85°C TA, MSP430FR6970IRGCR pinout, MSP430FR6970IRGCR datasheet PDF, MSP430FR6970IRGCR amp .Beyond Microcontrollers Texas Instruments MSP430FR6970IRGCR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments MSP430FR6970IRGCR


Microcontrollers Texas Instruments MSP430FR6970IRGCR Overview

The Texas Instruments MSP430FR6970IRGCR microcontroller is engineered for precision and performance, designed to meet the rigorous demands of modern embedded applications. This 16-bit MCU integrates 32KB of FRAM, providing a robust platform for developers seeking a blend of low-power consumption and high-speed processing capabilities. Ideal for applications requiring frequent or rapid data writes, FRAM technology offers the unique advantage of speed and endurance. Its integration in the MSP430FR6970IRGCR ensures not only energy efficiency but also enhanced system reliability. The compact 64-VQFN package encapsulates a range of features tailored for complex digital control systems, making the Microcontrollers Texas Instruments MSP430FR6970IRGCR a top choice for industry professionals.

MSP430FR6970IRGCR Features

The MSP430FR6970IRGCR boasts a plethora of features designed to enhance device functionality and developer experience. It supports a wide operating temperature range, making it suitable for harsh environments. Its low-power operation modes extend battery life, crucial for portable devices. With integrated peripherals such as multiple communication modules, developers can easily implement serial connections, enhancing device interconnectivity. The inclusion of an analog-to-digital converter (ADC) facilitates precise sensor readings, pivotal in automation and monitoring tasks.

MSP430FR6970IRGCR Applications

  • Smart Metering: Utilized in energy management systems to provide real-time data processing and communication, improving the efficiency and reliability of smart grids.
  • Wearable Devices: Serves as the core processing unit in wearables, managing sensor data integration and user interaction while optimizing power consumption to extend device life.
  • Home Automation: Employs its communication capabilities to orchestrate and streamline operations of various smart home devices, enhancing user convenience and system efficiency.
  • Industrial Monitoring: Integral in monitoring systems for detecting and reporting operational anomalies in industrial equipment, thereby minimizing downtime and maintenance costs.
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