MSMBJ30CA

Manufacturer :

Microchip Technology

Product Category :

Additional Feature :

High Reliability

Published :

1997

Terminal Form :

J BEND

Pin Count :

2

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Operating Temperature :

-65°C~150°C TJ

Test Current :

1mA

Type :

Zener

Package / Case :

DO-214AA, SMB

JESD-609 Code :

e0

Peak Pulse Current :

12.4A

Direction :

Bidirectional

Power - Peak Pulse :

600W

Mount :

Surface Mount

Diode Element Material :

SILICON

Power Line Protection :

No

Reverse Standoff Voltage :

30V

Voltage - Breakdown (Min) :

33.3V

Bidirectional Channels :

1

Number of Terminations :

2

Number of Pins :

2

Pbfree Code :

No

Element Configuration :

Single

Peak Pulse Power :

600W

RoHS Status :

Non-RoHS Compliant

ECCN Code :

EAR99

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Position :

Dual

Packaging :

Bulk

Terminal Finish :

Tin/Lead (Sn/Pb)

Series :

Military, MIL-PRF-19500

Max Reverse Leakage Current :

1μA

Clamping Voltage :

48.4V

Number of Elements :

1

Mounting Type :

Surface Mount

Peak Reflow Temperature (Cel) :

235

Time@Peak Reflow Temperature-Max (s) :

20

Applications :

GENERAL PURPOSE