MR25H256MDF

Manufacturer :

Everspin Technologies, Inc.

Product Category :

Memory

Max Power Dissipation :

600mW

Memory Density :

262144 bit

Memory Size :

256Kb 32K x 8

Memory Width :

8

Packaging :

Tray

Length :

6mm

RoHS Status :

ROHS3 Compliant

Interface :

SPI, Serial

Memory Format :

RAM

Operating Temperature :

-40°C~125°C TA

Surface Mount :

yes

Supply Voltage-Max (Vsup) :

3.6V

Memory Type :

Non-Volatile

Operating Mode :

SYNCHRONOUS

Factory Lead Time :

14 Weeks

Organization :

32KX8

Data Bus Width :

8B

Time@Peak Reflow Temperature-Max (s) :

40

Series :

Automotive, AEC-Q100

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Clock Frequency :

40MHz

Terminal Position :

Dual

Package / Case :

8-VDFN Exposed Pad

HTS Code :

8542.32.00.71

ECCN Code :

EAR99

Mounting Type :

Surface Mount

Number of Functions :

1

Terminal Pitch :

1.27mm

Published :

2013

Voltage - Supply :

2.7V~3.6V

Height Seated (Max) :

0.9mm

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

R-PDSO-N8

Number of Terminations :

8

Supply Voltage :

3.3V

Pin Count :

8

Supply Voltage-Min (Vsup) :

3V

Memory Interface :

SPI