MPF500T-1FCG784E

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Mfr.Part #
MPF500T-1FCG784E
Manufacturer
Microchip Technology
Package / Case
784-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 388 I/O 784FCBGA
Stock
35,501
In Stock :
35,501

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
12 Weeks
Series :
PolarFire™
Number of Logic Elements/Cells :
481000
Number of I/O :
388
Packaging :
Tray
Supplier Device Package :
784-FCBGA (29x29)
Mounting Type :
Surface Mount
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Package / Case :
784-BBGA, FCBGA
Total RAM Bits :
33792000
Voltage - Supply :
0.97V~1.08V
Operating Temperature :
0°C~100°C TJ
RoHS Status :
RoHS Compliant
Datasheets
MPF500T-1FCG784E
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology MPF500T-1FCG784E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:784-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, MPF500T-1FCG784E pinout, MPF500T-1FCG784E datasheet PDF, MPF500T-1FCG784E amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology MPF500T-1FCG784E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology MPF500T-1FCG784E


FPGAs Microchip Technology MPF500T-1FCG784E Overview

The MPF500T-1FCG784E, engineered by Microchip Technology, represents a pivotal advancement in the FPGAs (Field Programmable Gate Array) market, bringing versatile capabilities tailored for complex digital circuit designs. This IC FPGA is housed in a 784FCBGA package, supporting 388 I/O points, offering a robust platform for developers aiming to accelerate hardware performance and integration. The integration of high I/O count makes this FPGA an ideal choice for applications requiring high-speed data processing and connectivity, ensuring reliable and efficient performance across various uses.

MPF500T-1FCG784E Features

The MPF500T-1FCG784E FPGA stands out due to its extensive features tailored for high-performance and flexibility in design. Key attributes include its 784-pin flip-chip ball grid array (FCBGA) package, which facilitates superior electrical performance and heat dissipation. This component supports a wide array of configurations and programmability options, enhancing its utility in dynamically changing technological environments. Its high I/O count makes it adaptable for complex digital interactions and integrations necessary in today's advanced electronic designs.

MPF500T-1FCG784E Applications

  • Data Centers: Utilized for managing vast data flows and processing needs, enhancing operational efficiency and reliability in server management and network infrastructure.
  • Telecommunications: Critical in the deployment of base stations and network routers, where high-speed signal processing and data throughput are paramount for efficient communication.
  • Automotive Applications: Deployed in advanced driver-assistance systems (ADAS), facilitating rapid sensor data processing and integration to enhance vehicle safety and performance.
  • Industrial Automation: Integral to control systems requiring customizable logic solutions for real-time operations and machine control, ensuring robust and flexible industrial processes.
  • Consumer Electronics: Empowers high-performance computing tasks within consumer devices like high-definition multimedia interfaces and interactive gaming consoles, providing enhanced user experiences.
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