MPF300XT-1FCG784E

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Mfr.Part #
MPF300XT-1FCG784E
Manufacturer
Microsemi
Package / Case
784-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 388 I/O 784FCBGA
Stock
23,648
In Stock :
23,648

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
388
Packaging :
Tray
Voltage - Supply :
0.97V~1.08V
Number of Logic Elements/Cells :
300000
Operating Temperature :
0°C~100°C TJ
Total RAM Bits :
21094400
Series :
PolarFire™
Supplier Device Package :
784-FCBGA (29x29)
Package / Case :
784-BBGA, FCBGA
Mounting Type :
Surface Mount
Datasheets
MPF300XT-1FCG784E
Introducing FPGAs (Field Programmable Gate Array) Microsemi MPF300XT-1FCG784E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:784-BBGA, FCBGA, Mounting Type:Surface Mount, MPF300XT-1FCG784E pinout, MPF300XT-1FCG784E datasheet PDF, MPF300XT-1FCG784E amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi MPF300XT-1FCG784E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi MPF300XT-1FCG784E


FPGAs Microsemi MPF300XT-1FCG784E Overview

The FPGAs Microsemi MPF300XT-1FCG784E is a high-performance, field-programmable gate array designed to meet the increasing demands of sophisticated electronic systems. Manufactured by Microsemi, this IC features a dense configuration of 388 I/O options, housed in a compact 784FCBGA package, enabling versatile integration into a variety of hardware setups. The MPF300XT-1FCG784E is engineered for applications requiring high-speed data processing and high-reliability operations, making it an ideal choice for industry professionals looking to enhance system performance with robust, scalable, and efficient FPGA solutions.

MPF300XT-1FCG784E Features

This FPGA from Microsemi stands out due to its extensive feature set which supports a wide range of applications. Key features include a large number of input/output ports, high configurability, and a ball grid array (BGA) package that ensures a reliable electrical connection and heat distribution. Furthermore, its compatibility with advanced digital signal processing enhances its utility in complex computational tasks.

MPF300XT-1FCG784E Applications

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