MPC885ZP66

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Factory Lead Time :

12 Weeks

Number of Terminations :

357

Operating Temperature :

0°C~95°C TA

HTS Code :

8542.31.00.01

Supply Voltage :

1.8V

Series :

MPC8xx

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Height Seated (Max) :

2.52mm

Ethernet :

10Mbps (3), 10/100Mbps (2)

Package / Case :

357-BBGA

Supply Voltage-Min (Vsup) :

1.7V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Length :

25mm

Power Supplies :

1.83.3V

RAM Controllers :

DRAM

External Data Bus Width :

32

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

Voltage - I/O :

3.3V

RoHS Status :

Non-RoHS Compliant

Bit Size :

32

Terminal Form :

Ball

Terminal Position :

BOTTOM

Supply Voltage-Max (Vsup) :

1.9V

Boundary Scan :

yes

Integrated Cache :

yes

Security Features :

Cryptography

Low Power Mode :

yes

Co-Processors/DSP :

Communications; CPM, Security; SEC

Address Bus Width :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Format :

FIXED POINT

Base Part Number :

MPC885

JESD-609 Code :

e0

Terminal Pitch :

1.27mm

Terminal Finish :

Tin/Lead (Sn/Pb)

Speed :

66MHz

Published :

1999

JESD-30 Code :

S-PBGA-B357

Peak Reflow Temperature (Cel) :

245

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

ECCN Code :

5A002.A.1

Surface Mount :

yes

USB :

USB 2.0 (1)

Packaging :

Tray